Enhancing Interfacial Bond Strength Between PEEK and Inkjet-Printed Silver Film Through Laser Surface Modification for Additive Manufacturing of Electronics

Electronic 3D printing is a very promising technology, which is widely used in the manufacturing of conformal antennas, flexible electronics and sensors. Polyether ether ketone (PEEK) is one of the most popular substrate materials for electronic 3D printing due to its superior fatigue resistance, heat tolerance, chemical resistance, and mechanical properties. However, the deficient bond between the PEEK substrate and the conductive ink leads to the peeling and shedding of the conductive pattern. This paper investigated the enhancement of the bond strength between the PEEK substrate and the conductive layer through PEEK surface modification. A 355 nm ns solid-state laser was used to treat the PEEK surface with different values of laser scanning spacing (S) and spot overlap rate (R). The surface microstructure, surface roughness, wettability, and functional groups of the treated substrates have been measured. Then the nanoparticle silver ink was printed and cured on the treated substrate. After that, the bonding strength was measured using a pull-off adhesion tester. Results showed that regular grooves were generated and the content of active oxygen atoms was increased on the PEEK surface through laser modification. The mechanical interlocking between the grooves and silver particles and hydrogen bonds induced by the active oxygen atoms and the hydroxyl groups contribute to the enhancement of bond strength between PEEK and silver film. The bond strength for the laser treated PEEK reached the maximum of 1.9 MPa, which was 413.51% higher than that of the untreated PEEK. The laser modification can effectively enhance the interfacial bond strength for additive manufacturing of reliable electronics.