Dielectric, Electrical and Thermal Properties of Sodium Molybdate-hexagonal Boron Nitride Composites Enabled by Cold Sintering

Advances in 5G and 6G communication technologies and their applications are in part limited by the capabilities of current electronic packaging materials, as expanded bandwidth is a pressing need for novel dielectric substrates capable of co-firing into packages and devices, characterized by low dielectric loss and enhanced thermal conductivity. This investigation provides further characterization in the dielectric, electrical and thermal conductivity properties over previously reported cold sintered composite of Sodium Molybdate Na2Mo2O7 (NMO) with hexagonal Boron Nitride (hBN), such as relative permittivity (εr) and dielectric loss (tan δ) values at high frequencies of 75-110 GHz, electrical resistivity (ρ) fitting to percolation theory, Weibull statistical analysis of electrical breakdown strength (Eb) and its anisotropic thermal conductivity (κ) influenced by the filler’s crystal structure. The cold sintered composites were systematically characterized with respect to filler volume fraction, temperature, and frequency. The findings in this analysis position engineered composites as a promising alternative for microwave substrate materials, with using a densification method that limits interactions and maximizes densification, hence the demonstration with cold sintering.