Thermal Interface Materials with High Adhesion and Enhanced Thermal Conductivity Via Optimization of Polymer Networks and Filler Xiangchao Xie,Yunsong Pang,Shipeng Rao, Chen Zeng,Chenxu Zhang,Shifeng Guo, Jianbin Xu,Xiaoliang Zeng, Rong Suncrossref(2024)引用 0|浏览10暂无评分AI 理解论文溯源树样例生成溯源树,研究论文发展脉络Chat Paper正在生成论文摘要