Fabrication Tolerances Impact on an ODAC Based PAM-4 Transmitter

Photonic integrated circuits (PIC) devices are impacted by fabrication tolerances and therefore, prior knowledge of such variations could improve the PIC fabrication process and overall yield. This paper presents a method for predicting the fabrication impacts on a telecommunication optical digital to analog converter (oDAC)-based pulse amplitude modulator level four (PAM-4) transmitter as a case study where the certainty of this passive device is subjected to random variation. Our findings allow us to estimate the production yield in a fabrication scenario using the symbol error rate (SER) benchmark and this contributes to the study of the viability of oDAC PAM-4 transmitters to replace conventional electrical digital to analog converter (eDAC) PAM-4 transmitters.