基本信息
浏览量:7
职业迁徙
个人简介
Jie Deng (S’04–M’09–SM’13) received the B.S. degree in material science from Fudan University, Shanghai, China, in 2003, and the Ph.D. degree in electrical engineering from Lehigh University, Bethlehem, PA, USA, in 2009.
He has been a Compact Modeling Engineer with the Semiconductor Research and Development Center, IBM Microelectronics, Essex Junction, Vermont, USA, since 2010, where he has been involved in advanced CMOS technology and compact model development.
研究兴趣
论文共 24 篇作者统计合作学者相似作者
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S Lee,J A Johnson,Brian J Greene,A Chou,Keding Zhao, Morshed Chowdhury,Jaewoong Sim,Amit Kumar, Dohoon Kim,A K Sutton, Sherman Ku,Yong Liang, Yanli Wang,D Slisher,K Duncan, Patrick D Hyde,R Thoma,J Deng, Yangdong Deng, Raja Rupani,R Williams, Louis K Wagner,C Wermer,H Li, B E Johnson, D Daley,J O Plouchart,Shreesh Narasimha, C Putnam,E Maciejewski,W K Henson,Scott K Springer
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作者统计
#Papers: 24
#Citation: 251
H-Index: 8
G-Index: 15
Sociability: 5
Diversity: 3
Activity: 0
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