Mit der automatisierten Datenanalyse öffnet sich das Sicherheitsrecht für KI. Die Analysetools sind bereits jetzt regelmäßig als Hochrisiko-KI nach der neuen KI-Verordnung der EU einzustufen. Auch Bund und Länder schaffen neue Regulierungen für deren Einsatz. Damit verändert sich vor allem die Architektur des Sicherheitsrechts. Wo die verfassungsrechtlichen Grenzen dieser Entwicklung liegen, ist vielfach noch offen.
The past decade has seen the development of commercial, third-generation, high reliability Pb-free solder alloys designed to meet the requirements of higher temperature use environments. Most of these offerings are based on the Sn-Ag-Cu (SAC) system, with major alloying additions of bismuth (Bi), antimony (Sb), or indium (In). These elements, individually or in combination, promote additional precipitation, solid solution, or dispersion strengthening that can resist microstructural degradation at elevated temperatures or during aggressive thermal cycling. Results from the literature show that an increase in thermal cycling dwell time can decrease the thermal cycling reliability of SAC solders. Because these high reliability solder alloys are designed for extended operation at higher temperatures, it is important to understand their behavior and characterize their reliability at extended thermal cycling dwell times. This paper presents the initial results from an experimental program designed to compare thermal cycling results for high reliability solder alloys using a typical dwell time of 10 minutes to an extended dwell of 60 minutes. The 10-minute data were generated in the initial phase of testing and preliminary results were published previously. The current data are based on a thermal cycling test condition of −55/125 °C (TC7 in IPC-9701B) and the test vehicles are a 192-pin chip array ball grid array (192CABGA) and an 84-pin thin core ball grid array (84CTBGA). The high reliability alloys were found to outperform the prevalent SAC305 (Sn3.0Ag0.5Cu) consistently. With the 192CABGA, SAC305 showed a moderate loss of reliability with increased dwell time, but some high reliability alloys had comparable performance with 60-minute and 10-minute dwell times, and others performed much better with the 60-minute dwell. With the 84CTBGA, the high reliability alloys have comparable performance with 60-minute and 10-minute dwell times, with only one alloy performing slightly better with the 60-minute dwell. The surprising finding was that SAC305, when tested with the 84CTBGA, exhibits no dwell time effect with the −55/125 °C test condition. All the alloys exhibited thermal fatigue failures in the bulk solder, but most of the high reliability alloys also exhibited interfacial or mixed mode failures, which complicates interpretation of the data.
Gewalttaten sowie Polizeieinsätze, bei denen Messer eine Rolle spielen, haben wiederholt mediale Aufmerksamkeit erregt. Während sich internationale, aber auch nationale Studien zunehmend mit Messerangriffen beschäftigen, liegen bisher keine wissenschaftlichen Erkenntnisse zu Fällen vor, in denen Polizeibeamt:innen selbst Ziel solcher Angriffe sind. Der vorliegende Beitrag widmet sich dieser Forschungslücke und untersucht Einsatzanlässe, Einsatzdynamiken, Tatverdächtigenmerkmale sowie polizeiliche Maßnahmen in Fällen, in denen es zu Messerangriffen gegen Polizeibeamt:innen gekommen ist. Datengrundlage bilden auf Basis der Polizeilichen Kriminalstatistik (PKS) der Stadt Hamburg alle Fälle im Zeitraum 2019 bis Juni 2023, in denen Delikte mit dem Tatmittel „Messer“ und Polizeibeamt:innen als Geschädigte erfasst waren – eine Konstellation, die in der veröffentlichten Polizeilichen Kriminalstatistik nicht gesondert ausgewiesen wird. Vom Landeskriminalamt Hamburg wurden gemäß dieser Einschlusskriterien N = 44 Fälle identifiziert, deren Fallakten im Rahmen dieser Studie detailliert analysiert wurden. Die Ergebnisse zeigen, dass solche Angriffe am häufigsten im Rahmen von Amtshilfeeinsätzen oder bei Ruhestörungen stattfanden, aber auch nicht selten im Kontext von Suizidankündigungen oder Selbstverletzung. In 70,5
The past decade has seen the development and introduction of commercial, third-generation, high-performance Pb-free solder alloys designed to meet the requirements of higher temperature use environments. Most of these offerings are based on the Sn-Ag-Cu (SAC) system, with major alloying additions of bismuth (Bi), antimony (Sb), or indium (In). These elements, individually or in combination, promote additional precipitate, solid solution, or dispersion strengthening that can enhance resistance to degradation at elevated temperature or during aggressive thermal cycling. Results from the literature show that an increase in thermal cycling dwell time can decrease the thermal cycling reliability of SAC solders. Because high-performance alloys are designed for extended operation at higher temperatures, it is important to understand their behavior and characterize their reliability at extended thermal cycling dwell times. This paper presents the initial results from an experimental program designed to compare thermal cycling results for high-performance solder alloys using an extended dwell of 60 minutes to a typical short dwell time of 10 minutes. The 10-minute dwell data were generated in the initial phase of testing and published previously. The data reported here are from a thermal cycling profile of -55/125 °C (TC7 in IPC9701B) and the test vehicle is a 192-pin chip array ball grid array (192CABGA). Contrary to the results for SAC solders, the 60 minute dwell time did not reduce the reliability consistently for all the high-performance alloys in the test matrix. Based on evaluation criteria of characteristic lifetime and 1% cumulative failure rate from a 2-parameter Weibull plot, the high-performance alloys had comparable reliability performance with 60-minute and 10-minute dwell times. Although all the alloys exhibited fatigue failures in the bulk solder, many of the alloys also exhibited interfacial and mixed mode failures, which complicates interpretation of the data. Multiple failure modes for these solder alloys also were reported for the 10-minute dwell testing.
