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    Laboratoire Ampère

    企业EST. 1999
    652论文总数
    3,640引用总数

    论文量&引用量时间轴

    机构学者

    排序
    Dominique Planson
    Dominique Planson
    INSA de Lyon
    论文:45引用:0H-index:0
    Pascal Venet
    Pascal Venet
    Université de Lyon;Bâtiment F;Rue Thierry Mieg;Bâtiment F, Université de Lyon
    论文:27引用:0H-index:0
    Bruno Allard
    Bruno Allard
    Universites en Electronique de Puissance Integree
    论文:27引用:0H-index:0
    Christian Vollaire
    Christian Vollaire
    Universidade Federal de Minas Gerais;University of Akron;Universidade Federal de Minas Gerais, University of Akron
    论文:26引用:0H-index:0
    Eric Bideaux
    Eric Bideaux
    Laboratoire AMPERE
    论文:25引用:0H-index:0
    laurent krahenbuhl
    laurent krahenbuhl
    INSA Lyon, Université de Lyon Ecully France
    论文:23引用:0H-index:0
    Riccardo Scorretti
    Riccardo Scorretti
    Ecole Centrale de Lyon
    论文:19引用:0H-index:0
    Pierre Brosselard
    Pierre Brosselard
    Ampere Lab, Univ Lyon
    论文:18引用:0H-index:0
    Ronan Perrussel
    Ronan Perrussel
    Université de Lyon;Ecole Centrale de Lyon;Ecole Centrale de Lyon, Université de Lyon
    论文:18引用:0H-index:0

    论文(652)

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    1Permanent Degradation of P-Gan HEMTs Due to Repetitive Overvoltage Stress During Hard Turn-off Switching
    Thomas Vadebout,Pascal Bevilacqua, Valeria Rustichelli, Maroun Alam, Laurence Allirand,Herve Morel

    This study investigates the long-term impact of dynamic overvoltage stress on GaN HEMTs using a newly designed test circuit, UIS3, a variant of classic UIS, which isolates key stress factors. Devices were subjected to short-duration repetitive overvoltage stress near and below their dynamic breakdown voltage. Characterization before and after stress reveals permanent degradation in CDS, IDSS and IGSS, suggesting deep-trapping or structural damage within the device. A distinct alteration in the CDS curve is observed, may indicate less spreading of the electric-field within the device. RDS,on degradation is also noted, likely due to trapping effects, with partial recovery at room temperature. Higher stress levels accelerate failure. Waveform analysis and post-failure characterization indicate a short-circuit failure mode, likely due to partial dielectric breakdown during overvoltage events. These results provide new insights into GaN HEMT degradation mechanisms under high-voltage stress.

    2026MICROELECTRONICS RELIABILITY(2026)
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    2Physics-Informed Hybrid Modeling of Pneumatic Artificial Muscles
    Wang, Genmeng,Chalard, Rémi,Jenny Alexandra, Cifuentes,Pham, Minh Tu

    Pneumatic Artificial Muscles (PAMs) are complex nonlinear systems characterized by hysteresis, making them challenging to model with classical system identification methods. While deep learning has emerged as a powerful tool for modeling nonlinear systems from data, purely neural networkbased models often lack interpretability and are prone to overfitting. To address these challenges, this study explores several hybrid approaches that combine analytical models with neural networks to model PAM behavior more effectively. The results demonstrate that hybrid models significantly outperform both purely analytical and black-box neural network models, particularly in terms of generalization and dynamic accuracy. Among the approaches, the Physics-Informed Neural Network (PINN) unsupervised model shows the most robust performance, capturing complex PAM dynamics while maintaining computational efficiency. These findings suggest that hybrid modeling is a promising and scalable solution for accurately representing the intricate behavior of PAMs.

    2025ICRA 2025(2025)引用:2
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    3Addressing Limitations of TinyML Approaches for AI-Enabled Ambient Intelligence
    Antoine Bonneau,Frédéric Le Mouël,Fabien Mieyeville

    The integration of Artificial Intelligence (AI) and Ambient Intelligence (AmI) has emerged as a promising approach to creating responsive and contextually aware environments. AmI creates contextually aware environments by seamlessly integrating intelligent technologies, while AI develops algorithms for autonomous learning and decision-making. However, embedding AI within AmI environments faces challenges due to limited resources and energy constraints. While recent research on embedded AI has primarily focused on specific tasks of AmI, our goal is to develop a comprehensive framework encompassing all the necessary components for practical use cases. Through this endeavor, we aim to explore power-aware designs and distributed learning as fundamental approaches to address limited computational resources, energy constraints, and dynamic context variations challenges.

    2025Machine Learning and Principles and Practice of Knowledge Discovery in Databases(2025)引用:1
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    4Haptic Training Simulators Design Approach
    Florence Zara,Benjamin Delbos,Rémi Chalard,Richard Moreau,Fabrice Jaillet,Arnaud Lelevé

    Learning medical gestures requires regular hands-on training to acquire the dexterity needed to perform them without injuring patients. For obvious ethical reasons, this training cannot be carried out directly on the patient. In this context, the use of cadavers has long been the preferred method of training, despite the difficulty of obtaining them and the fact that cadavers deteriorate rapidly. For several years, technologies have led to the development of medical training simulators that combine a numerical simulation (reproducing the organs' behavior during the gesture) with haptic devices (reproducing tactile sensations). As designers of several haptic training simulators, we aim to impart our expertise by detailing in this paper an empirical design methodology for the development of such simulators.

    2025Smart Multimedia(2025)引用:1
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    5Electrical Characterization of HV (10 Kv) Power 4H-Sic Bipolar Junction Transistor
    Pierre Brosselard, Brenda Fosso-Sob,Dominique Planson,Pascal Bevilacqua,Camille Sonneville,Mihai Lazar,Bertrand Vergne,Sigo Scharnholz,Hervé Morel

    In this paper, the static and dynamic characterization of a High Voltage (10kV) 4H-SiC Bipolar Junction Transistor (BJT) is presented. Using a high-voltage source in vacuum conditions, a breakdown voltage of 11 kV was measured. Results showed that both large and small BJTs exhibit similar on-state resistance per unit area and collector current density of 55 A.cm-2. The current gain increases with a decrease in temperature, indicating reduced charge carrier recombination at lower thermal energies. Also, BJT have been characterized in switching mode at 1 kV. The study concludes that 4H-SiC BJT demonstrates promising electrical performance for high-efficiency applications in harsh environments.

    2025Key Engineering Materials(2025)
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    合作机构(100)

    University of Lyon System合作论文 15
    Supergrid Institute合作论文 14
    French-German Research Institute of Saint-Louis合作论文 12
    原子能和替代能源委员会合作论文 12
    法国国家科学研究中心合作论文 11
    Universidade Politecnica合作论文 9
    Centro Nacional de Microelectrónica,Spanish National Research Council合作论文 6
    Institut des Nanotechnologies de Lyon合作论文 6
    雷诺合作论文 5
    里昂克劳德·伯纳德大学1合作论文 5

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