With the advancement of sustainable power and transparent electronics, energy storage devices are increasingly required to combine high optical transparency with excellent energy storage performance. To address this demand, we fabricated Pb1−xEuxZrO3 antiferroelectric thin films on fluorine-doped tin oxide (FTO)/glass via chemical solution deposition. By varying Eu3+ concentration (x = 0 –0.09), we investigated its effect on microstructure, transparency, and energy storage. A recoverable energy density of 43.1 J/cm3 and a visible transmittance of 75% are achieved in the film with x = 0.05, ranking among the best transparent antiferroelectric capacitors. This Eu3+ doping strategy offers a promising route for developing highly transparent energy storage components for next-generation transparent electronics.
Additive manufacturing of Ti6Al4V/CoCrFeNi dissimilar metals is fundamentally limited by the strong chemical affinity of Ti with Fe, Co, and Ni, which causes brittle intermetallic compounds and severe interfacial cracking. Although ductile Cu interlayers with favorable metallurgical compatibility improve interfacial bonding, the formation of continuous Cu-Ti intermetallic compounds may still degrade interfacial integrity and trigger premature failure. An Al-modified Cu interlayer strategy is developed to regulate interfacial reactions during laser-directed energy deposition. The addition of Al redirects interfacial phase evolution from multiple continuous Cu-Ti binary compounds to a Cu/Cu2TiAl networked heterostructure, reducing lattice mismatch and improving metallurgical bonding with suppressed interfacial cracking. Unexpectedly, the continuous Cu-rich network promotes plastic accommodation and suppresses local stress concentration. Consequently, the interfacial shear strength of the interlayer/CoCrFeNi interface increases from 185.1 to 321.7 MPa, representing a 73.8% improvement. This work establishes a composition-mediated pathway for interfacial compound formation to convert deleterious intermetallic formation into mechanically compatible heterostructures, offering insights into interlayer design for additive joining of Ti-based dissimilar metals with severe metallurgical incompatibility.
