All Copper Nice Modules

D. Reinwand,D. Pysch,N. Bay,J. Burschik, H.H. Kuehnlein,F. Madon,R. Einhaus,A. Brand,V. Arya, B. Smith, D. Richter,D. Kray

2018 IEEE 7TH WORLD CONFERENCE ON PHOTOVOLTAIC ENERGY CONVERSION (WCPEC) (A JOINT CONFERENCE OF 45TH IEEE PVSC, 28TH PVSEC & 34TH EU PVSEC)（2018）

Univ Appl Sci Offenburg

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摘要

In this work the first All Copper NICE (New Industrial Solar Cell Encapsulation) modules with solder-free ribbon to finger interconnections are presented. Experiments were conducted to investigate if silver can be fully omitted from solar cells with copper plated fingers in combination with the NICE module technology. We could show that silver flash plating, front and rear silver busbars or pads can be omitted without compromising series resistance or module performance. All Copper NICE modules were manufactured with fillfactors up to 76.8 %.

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关键词

silicon solar cell, solar modules, copper plating, pressure contacts, NICE technology

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