Consortium for Intelligent Large Area Processing (Cilap)
GT Wells, CC Chau,PE Garrou,R Heistand,S Cummings,T Rehg, C Ho, E Chieh,G Gibson,C Newquist, R Kruzek, C Ellec,L Vogt Microelectronics Journal（1996）SCI 3区SCI 4区
DOW CHEM CO USA
关键词
large area processing,LAP,intelligent processing,multichip module,thin film processing,extrusion coating,benzocyclobutene,BCB,rapid thermal curing
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