学术搜索
科研智能体
- Research Labs
- AI 阅读
- AI 文库
- AMiner 沉思
- AMiner 亮点
学术资源
- AI2000
- 期刊/会议
- 学者库
- 学术API
- 溯源树
- 数据集
知识沉淀
- 学术空间

订阅小程序

旧版功能

立即登录

学术搜索
科研智能体
- Research Labs
- AI 阅读
- AI 文库
- AMiner 沉思
- AMiner 亮点
学术资源
- AI2000
- 期刊/会议
- 学者库
- 学术API
- 溯源树
- 数据集
知识沉淀
- 学术空间

订阅小程序

旧版功能

立即登录

How 3D Integration Technologies Enable Advanced Compute Node for Exascale-level High Performance Computing? | AMiner

How 3D Integration Technologies Enable Advanced Compute Node for Exascale-level High Performance Computing?

D. Dutoit,P. Coudrain, P-Y Martinez,P. Vivet,J. Charbonnier,A. Garnier,D. Lattard,S. Cheramy,E. Guthmuller,A. Philippe,Y. Thonnart,F. Clermidy

2020 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)（2020）

Univ Grenoble Alpes

被引用2|浏览32

摘要

Supercomputers will soon achieve Exascale-level computing performances mainly thanks to the introduction of innovative hardware technologies around the processors. This article explains architectural and performance evolutions and describes how 3D integration technologies have allowed heterogeneity and increased bandwidth that are decisive for hardware innovations contributing to Exascale.

查看译文

关键词

advanced compute node,innovative hardware technologies,performance evolutions,3D integration technologies,hardware innovations,exascale-level computing performances,exascale-level high performance computing

PDF