Optoelectronic Backplane Interconnect Technology Development - Point

YS Liu, WB Hennessy,R Wojnarowski,JP Bristow,Y Liu,J Rowlette, J Stack,J Yardley,L Eldada,RM Osgood,R Scarmozzino, SH Lee,S Patra

Proceedings of SPIE--the International Society for Optical Engineering（1997）

GE CO

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摘要

This paper describes the technical approach and progresses of the POINT program. This project is a collaborative effort among GE, Honeywell, AMP, AlliedSignal, Columbia University and University of California at San Diego, sponsored by DARPA/ETO to develop affordable optoelectronic packaging and interconnect technologies for board and backplane applications. In this paper, we report the development of a backplane interconnect structure using polymer waveguides to an interconnect length of 280 mm to demonstrate high density and high speed interconnect, and the related technical development efforts on: (a) a high density and high speed VCSEL array packaging technology that employs planar fabrication and batch processing for low-cost manufacturing, (b) passive alignment techniques for reducing recurrent cost in optoelectronic assembly, (c) low-cost optical polymers for board and backplane level interconnects, and (d) CAD tools for modeling multimode guided wave systems and assisting optoelectronic packaging mechanical design.

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关键词

optical interconnect,optoelectronic packaging,high speed optical links,backplane and board interconnect,VCSEL packaging,polymer waveguide,Polyguide(R)