As a first step towards correlation of system level ESD robustness based on component level ESD results, on-wafer Human Metal Model (HMM) measurements are compared with on-wafer HBM for a wide range of devices in various process technologies. A device level System to Component level Correlation Factor (SCCF) is defined and can range from 10 to 150% based upon physical failure mechanisms. Five main categories are defined independent of process technology.
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electrostatic discharge,failure analysis,integrated circuit reliability,SCCF,component level ESD,on-wafer HBM,on-wafer human metal model measurements,physical failure mechanisms,process technology,system level ESD robustness correlation,system to component level correlation factor
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