System-Level Fast Optimization Method for High-Speed Circuits Based on Electro-Thermal Equivalent Modeling

As chip dimensions scale down and data rates increase, thermal management has become a critical challenge in high-speed and high-power electronic systems, making electro-thermal co-design increasingly crucial. However, conventional transient thermal analysis relies on repeated three-dimensional simulations, leading to long computation times and low efficiency during design optimization. This work proposes a fast thermal equivalent modeling approach based on electro-thermal analogy. Steady-state thermal resistance and transient thermal capacitance are extracted and mapped to electrical resistance and capacitance to construct a physically meaningful RC thermal equivalent circuit. The transient temperature response is accurately reproduced through RC charge and discharge behavior in the electrical domain. By adjusting thermal resistance and capacitance parameters, transient thermal behavior can be rapidly evaluated without re-running full 3D thermal simulations. The proposed method reduces simulation time from several hours to approximately five seconds while maintaining high accuracy.