2021 INTERNATIONAL CONFERENCE ON SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES (SISPAD 2021)(2021)
Intel Corp
被引用1|浏览22
摘要
Process and device simulation has been invaluable for logic technology development for many technology nodes. The main goal of this work will be to review the broad and diverse simulation hierarchy that is used in industry to understand and optimize both current and future device technology options. This hierarchy spans both continuum modeling and atomistic methods / beyond continuum tools. Current process and device simulation results will be presented along possible extensions to the hierarchy to improve TCAD’s ability to help technology development.