Using MD Simulation to Evaluate the Effects of Working Fluid, Wall Material, and Wall Layering of a Nano-Grooved Flat Plate Heat Pipe

Monitoring and dissipating the heat generated by semiconductor-based components, including microprocessors, is necessary for their stability and optimal performance. The use of heat pipes (HPs) as passive instruments makes this possible without the need for any additional energy sources. The application of flat plate nano-HPs in microprocessors has materialized by recent developments in nanoscale device manufacturing. The effectiveness of a cell of this kind of HP has been investigated in this article. While focusing on the impact of wall thickness, the velocity, density, and temperature profiles, and also mass and heat transmission have been calculated under various circumstances. The molecular dynamics simulation findings indicated that the mass transfer rate has increased as the wall layer numbers have increased, under all circumstances. The atomic structure of the working fluid has a significant impact on the mass transfer rate inside nano-HPs. The maximum and minimum heat fluxes are 1896 W/cm2 and 1392 W/cm2, which respectively relate to water and argon. The overall performance of HP significantly relates to the circulation rate of the working fluid. Using Cu-EtOH leads to the maximum mean velocity (0.096 & Aring;/ps). Cu-EtOH and Pt-Ar respectively, shows the highest and lowest average temperatures, as 463.1 K and 404.7 K.