[0001]CROSS-REFERENCE TO RELATED APPLICATION
[0002]This application claims the priority benefit of China application serial no. 202010720584.5, filed on Jul. 24, 2020. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.
[0003]BACKGROUND
[0004]Technical Field
[0005]The disclosure relates to an optical element and a projector, and in particular, relates to a wavelength conversion element and a projector with this wavelength conversion element.
[0006]Description of Related Art
[0007]In a solid state illumination (SSI) projector apparatus, laser can be used as the light source. The phosphor wheel is located on the transmission path of the illumination light beam of the light source module. The blue laser light source is projected on the light conversion region of the phosphor wheel through the lens, so as to excite the yellow light source to achieve light combination. Generally, the temperature on the phosphor wheel may be conducted to the aluminum alloy substrate with high thermal conductivity, and that heat generated by the phosphor wheel when being excited may be dissipated accordingly. Nevertheless, the substrate with high thermal conductivity require high manufacturing costs and thus are less suitable for mass production. Further, the hardness of the substrate with high thermal conductivity is also higher, and a less favorable processability is therefore provided.
[0008]The information disclosed in this BACKGROUND section is only for enhancement of understanding of the background of the described technology and therefore it may contain information that does not form the prior art that is already known to a person of ordinary skill in the art. Further, the information disclosed in the Background section does not mean that one or more problems to be resolved by one or more embodiments of the invention was acknowledged by a person of ordinary skill in the art.
[0009]SUMMARY
[0010]The disclosure provides a wavelength conversion element exhibiting a favorable heat dissipation effect and providing improved conversion efficiency. The disclosure also provides a projector including the wavelength conversion element and exhibiting favorable projection quality and product competitiveness.
[0011]Other objects and advantages of the disclosure can be further illustrated by the technical features broadly embodied and described as follows.
[0012]In order to achieve one or a portion of or all of the objects or other objects, an embodiment of the disclosure provides a wavelength conversion element including a substrate, a wavelength conversion layer, a reflective layer, and a heat conductive layer. The wavelength conversion layer is disposed on the substrate. The reflective layer is disposed on the substrate and is located between the substrate and the wavelength conversion layer. The heat conductive layer is disposed on the substrate, and at least a portion of the heat conductive layer is located between the substrate and the reflective layer.
[0013]In order to achieve one or a portion of or all of the objects or other objects, an embodiment of the disclosure provides a projector including a light-emitting unit, a wavelength conversion element, a light valve, and a projection lens. The light-emitting unit is configured to emit an illumination light beam. The wavelength conversion element is disposed on a transmission path of the illumination light beam. The wavelength conversion element includes a substrate, a wavelength conversion layer, a reflective layer, and a heat conductive layer. The wavelength conversion layer is disposed on the substrate. The reflective layer is disposed on the substrate and is located between the substrate and the wavelength conversion layer. The heat conductive layer is disposed on the substrate, and at least a portion of the heat conductive layer is located between the substrate and the reflective layer. The light valve is disposed on the transmission path of the illumination light beam and is configured to convert the illumination light beam into an image light beam. The projection lens is disposed on a transmission path of the image light beam and is configured to project the image light beam.
[0014]Based on the above, the embodiments of the invention have at least one of the following advantages or effects. In the design of the wavelength conversion element provided by the disclosure, at least a portion of the heat conductive layer is located between the substrate and the reflective layer. In this way, the thermal conductivity of the wavelength conversion element is increased, and that conversion efficiency of the wavelength conversion element is further enhanced. In addition, the projector adopting the wavelength conversion element provided by the disclosure may feature favorable projection quality and product competitiveness.
[0015]Other objectives, features and advantages of the present invention will be further understood from the further technological features disclosed by the embodiments of the present invention wherein there are shown and described preferred embodiments of this invention, simply by way of illustration of modes best suited to carry out the invention.
[0016]BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention. FIG. 1A is a schematic view of a projection apparatus according to an embodiment of the disclosure. FIG. 1B is a cross-sectional schematic view of a wavelength conversion element of the projection apparatus of FIG. 1A . FIG. 2 to FIG. 16 are cross-sectional schematic views each illustrating a wavelength conversion element according the embodiments of the disclosure.
[0017]DESCRIPTION OF THE EMBODIMENTS
[0018]In the following detailed description of the preferred embodiments, reference is made to the accompanying drawings which form a part hereof, and in which are shown by way of illustration specific embodiments in which the invention may be practiced. In this regard, directional terminology, such as “top,” “bottom,” “front,” “back,” etc., is used with reference to the orientation of the Figure(s) being described. The components of the present invention can be positioned in a number of different orientations. As such, the directional terminology is used for purposes of illustration and is in no way limiting. On the other hand, the drawings are only schematic and the sizes of components may be exaggerated for clarity. It is to be understood that other embodiments may be utilized and structural changes may be made without departing from the scope of the present invention. Also, it is to be understood that the phraseology and terminology used herein are for the purpose of description and should not be regarded as limiting. The use of “including,” “comprising,” or “having” and variations thereof herein is meant to encompass the items listed thereafter and equivalents thereof as well as additional items. Unless limited otherwise, the terms “connected”, “coupled”, and “mounted” and variations thereof herein are used broadly and encompass direct and indirect connections, couplings, and mountings. Similarly, the terms “facing,” “faces” and variations thereof herein are used broadly and encompass direct and indirect facing, and “adjacent to” and variations thereof herein are used broadly and encompass directly and indirectly “adjacent to”. Therefore, the description of “A” component facing “B” component herein may contain the situations that “A” component directly faces “B” component or one or more additional components are between “A” component and “B” component. Also, the description of “A” component “adjacent to” “B” component herein may contain the situations that “A” component is directly “adjacent to” “B” component or one or more additional components are between “A” component and “B” component. Accordingly, the drawings and descriptions will be regarded as illustrative in nature and not as restrictive.
[0019]FIG. 1A is a schematic view of a projection apparatus according to an embodiment of the disclosure. With reference to FIG. 1 , in the present embodiment, a projector 10 includes a light-emitting unit 100 , a wavelength conversion element 200 a , a light valve 300 , and a projection lens 400 . The light-emitting unit 100 is configured to emit an illumination light beam L 1 , and the wavelength conversion element 200 a is disposed on a transmission path of the illumination light beam L 1 . The light valve 300 is disposed on the transmission path of the illumination light beam L 1 and is configured to convert the illumination light beam L 1 into an image light beam L 2 . The projection lens 400 is disposed on a transmission path of the image light beam L 2 and is configured to project the image light beam L 2 .
[0020]To be specific, the light-emitting unit 100 provided by this embodiment includes, for example, a laser diode (LD) such as a laser diode bank. Specifically, light sources that meet the volume requirements may all be implemented according to actual design, and the disclosure is not limited thereto. The light valve 300 includes, for example, a reflective light modulator such as a liquid crystal on Silicon panel (LCoS) panel and a digital micro-mirror device (DMD). In an embodiment, the light valve 300 includes, for example, a transmissive light modulator such as a transparent liquid crystal panel, an electro-optical modulator, a magneto-optic modulator, and an acousto-optic modulator (AOM), but a form and a type of the light valve 300 is not particularly limited in the present embodiment. Detailed steps and implementation of a method of converting the illumination light beam L 1 into the image light beam L 2 by the light valve 300 may be obtained through sufficient teachings, suggestions, and other details in the art, and that repeated description is not provided herein. In addition, the projection lens 400 includes, for example, one or a plurality of optical lens combinations with identical or different refracting powers including various non-planar lens combinations of a biconcave lens, a biconvex lens, a concave-convex lens, a convex-concave lens, a plane-convex lens, and a plane-concave lens, for example. In an embodiment, the projection lens 400 may also include a planar optical lens to project the image light beam L 2 out of the projector 10 through a reflective or penetrative manner. Herein, a form and a type of the projection lens 400 is not particularly limited in the present embodiment.
[0021]FIG. 1B is a cross-sectional schematic view of a wavelength conversion element of the projection apparatus of FIG. 1A . With reference to FIG. 1B , in this embodiment, the wavelength conversion element 200 a includes a substrate 210 a , a wavelength conversion layer 220 a , a reflective layer 230 a , and a heat conductive layer 240 a . The wavelength conversion layer 220 a and the reflective layer 230 a are both disposed on the substrate 210 a , and the reflective layer 230 a is located between the substrate 210 a and the wavelength conversion layer 220 a . The heat conductive layer 240 a is disposed on the substrate 210 a , and at least a portion of the heat conductive layer 240 a is located between the substrate 210 a and the reflective layer 230 a . As shown in the embodiment of FIG. 1B , the heat conductive layer 240 a directly contacts the substrate 210 a and directly contacts the reflective layer 230 a . In this case, thermal energy generated by the wavelength conversion layer 220 a during excitation may be transmitted to the substrate 210 a through the reflective layer 230 a and the heat conductive layer 240 a . As shown in FIG. 1B , an orthogonal projection of the heat conductive layer 240 a on the substrate 210 a is less than the substrate 210 a and completely overlaps an orthogonal projection of the reflective layer 230 a on the substrate 210 a and an orthogonal projection of the wavelength conversion layer 220 a on the substrate 210 a . For instance, an area of the orthogonal projection of the heat conductive layer 240 a on the substrate 210 a is less than an area of the substrate 210 a . Nevertheless, the disclosure is not limited thereto.
[0022]In some embodiments, the substrate 210 a is, for example, a heat dissipation substrate, and a material thereof is, for example, aluminum, but is not limited thereto. The heat conductive layer 240 a includes a heat conductive material and a filler material. A thermal conductivity coefficient of the heat conductive material is between 200 W/m·K and 5000 W/m·K. Further, the heat conductive material may be solid at room temperature and may be, for example, graphene, diamond, silver, copper, aluminum, gold, silicon carbide, or a combination of the foregoing. The filler material may be non-solid at room temperature and may be, for example, silicon dioxide colloid, zirconium dioxide colloid, silicone resin, epoxy resin, ceramic resin, silicone, silica sol, silicate, phosphate, sulfate, borate, or a combination of the foregoing, but is not limited thereto. The heat conductive material and the filler material are mixed to form a heat conductive layer coating. The filler material in the heat conductive layer coating is cured through a curing process, and the heat conductive layer 240 a is then formed. Since a thermal conductivity of the heat conductive material is approximately 20 times greater than that of a general heat conductive substrate, so that the heat conductive layer 240 a may achieve a favorable heat conduction effect. Accordingly, in this embodiment, a conventional substrate with high costs and a high thermal conductivity is not required to be adopted, and that the problem of processing difficulty caused by excessive hardness of a heat conductive substrate featuring high thermal conductivity is also prevented.
[0023]In this embodiment, since at least a portion of the heat conductive layer 240 a is located between the substrate 210 a and the reflective layer 230 a , a heat conduction effect of the substrate 210 a is improved. Accordingly, a thermal conductivity of the wavelength conversion element 200 a is improved, and that optical conversion efficiency of the wavelength conversion element 200 a is further enhanced. As such, the projector 10 adopting the wavelength conversion element 200 a provided by this embodiment may feature favorable projection quality and product competitiveness.
[0024]It should be noted that the reference numerals and a part of the contents in the previous embodiment are used in the following embodiments, in which identical reference numerals indicate identical or similar components, and repeated description of the same technical contents is omitted. Please refer to the descriptions of the previous embodiment for the omitted contents, which will not be repeated hereinafter.
[0025]FIG. 2 is a cross-sectional schematic view illustrating a wavelength conversion element according to an embodiment of the disclosure. With reference to FIG. 1B and FIG. 2 , a wavelength conversion element 200 b provided by this embodiment is similar to the wavelength conversion element 200 a provided by FIG. 1B , and a difference therebetween is that an orthogonal projection of a heat conductive layer 240 b of the wavelength conversion element 200 b on the substrate 210 a is greater than the orthogonal projection of the reflective layer 230 a on the substrate 210 a . Specifically, the orthogonal projection of the heat conductive layer 240 b on the substrate 210 a completely overlaps the substrate 210 a , and the orthogonal projection of the reflective layer 230 a on the substrate 210 a completely overlaps the orthogonal projection of the wavelength conversion layer 220 a on the substrate 210 a . That is, the heat conductive layer 240 b is distributed on the entire substrate 210 a , so that thermal energy may be additionally diffused to a non-wavelength conversion region before being transmitted to the substrate 210 a . That is, an area of heat conduction to the substrate 210 a is expanded, so that the heat conduction effect is further enhanced.
[0026]FIG. 3 is a cross-sectional schematic view illustrating a wavelength conversion element according to another embodiment of the disclosure. With reference to FIG. 2 and FIG. 3 , a wavelength conversion element 200 c provided by this embodiment is similar to the wavelength conversion element 200 b provided by FIG. 2 , and a difference therebetween is that a heat conductive layer 240 c extends and covers a side surface S of a reflective layer 230 c in a direction D parallel to an optical axis of excitation light of the wavelength conversion layer 220 a . Specifically, in this embodiment, the heat conductive layer 240 c contacts a bottom surface B of the wavelength conversion layer 220 a , and an orthogonal projection of the heat conductive layer 240 c on the substrate 210 a completely overlaps the orthogonal projection of the wavelength conversion layer 220 a on the substrate 210 a.
[0027]In the present embodiment, since the heat conductive layer 240 c may directly contact the bottom surface B of the wavelength conversion layer 220 a , the thermal energy generated by the wavelength conversion layer 220 a during excitation may be directly transmitted to the substrate 210 a , and that a favorable heat conduction effect is provided. In addition, since the heat conductive layer 240 c may also contact the side surface S of the reflective layer 230 c directly, thermal energy accumulated by the reflective layer 230 c may also be transmitted to the substrate 210 a from a lateral side, and that the heat conduction effect provided by the wavelength conversion element 200 c is further enhanced.
[0028]FIG. 4 is a cross-sectional schematic view illustrating a wavelength conversion element according to another embodiment of the disclosure. With reference to FIG. 3 and FIG. 4 , a wavelength conversion element 200 d provided by this embodiment is similar to the wavelength conversion element 200 c provided by FIG. 3 , and a difference therebetween is that an orthogonal projection of a heat conductive layer 240 d on the substrate 210 a completely overlaps the substrate 210 a in this embodiment. Since the heat conductive layer 240 d is distributed on the entire substrate 210 a , so that thermal energy may be additionally diffused to a non-wavelength conversion region before being transmitted to the substrate 210 a . That is, an area of heat conduction to the substrate 210 a is expanded, so that the heat conduction effect is further enhanced.
[0029]FIG. 5 is a cross-sectional schematic view illustrating a wavelength conversion element according to another embodiment of the disclosure. With reference to FIG. 1B and FIG. 5 , a wavelength conversion element 200 e provided by this embodiment is similar to the wavelength conversion element 200 a provided by FIG. 1B , and a difference therebetween is that an orthogonal projection of a heat conductive layer 240 e on the substrate 210 a is greater than an orthogonal projection of the reflective layer 230 c on the substrate 210 a and an orthogonal projection of a wavelength conversion layer 220 e on the substrate 210 a in this embodiment. Specifically, the heat conductive layer 240 e extends and covers a first side surface 51 of a reflective layer 230 e and a second side surface S 2 of the wavelength conversion layer 220 e in a direction D parallel to an optical axis of excitation light of the wavelength conversion layer 220 e . That is, the heat conductive layer 240 e may be distributed on the second side surface S 2 of the wavelength conversion layer 220 e , so that thermal energy generated by the wavelength conversion layer 220 e during excitation may be directly transmitted to the substrate 210 a , and that a favorable heat conduction effect is provided. In addition, since the heat conductive layer 240 e may directly contact the first side surface 51 of the reflective layer 230 c , the thermal energy accumulated by the reflective layer 230 c may also be transmitted to the substrate 210 a from a lateral side, and that the heat conduction effect provided by the wavelength conversion element 200 e is further enhanced.
[0030]FIG. 6 is a cross-sectional schematic view illustrating a wavelength conversion element according to another embodiment of the disclosure. With reference to FIG. 5 and FIG. 6 , a wavelength conversion element 200 f provided by this embodiment is similar to the wavelength conversion element 200 e provided by FIG. 5 , and a difference therebetween is that an orthogonal projection of a heat conductive layer 240 f on the substrate 210 a completely overlaps the substrate 210 a in this embodiment. Since the heat conductive layer 240 f is distributed on the entire substrate 210 a , so that thermal energy may be additionally diffused to a non-wavelength conversion region before being transmitted to the substrate 210 a . That is, an area of heat conduction to the substrate 210 a is expanded, so that the heat conduction effect is further enhanced.
[0031]FIG. 7 is a cross-sectional schematic view illustrating a wavelength conversion element according to another embodiment of the disclosure. With reference to FIG. 1B and FIG. 7 , a wavelength conversion element 200 g provided by this embodiment is similar to the wavelength conversion element 200 a provided by FIG. 1B , and a difference therebetween is that in this embodiment, a substrate 210 g includes a base board 212 and a surface treatment layer 214 g , and at least a portion of the surface treatment layer 214 g is located between the heat conductive layer 240 a and the base board 212 . Herein, a material of the base board 212 is, for example, aluminum, and a material of the surface treatment layer 214 g is a porous material. The surface treatment layer 214 g has a non-smooth surface, exhibits a reflective property, is preferably made of alumina, and may be obtained by oxidizing the material of the base board 212 itself, but is not limited thereto. Specifically, in this embodiment, an orthogonal projection of the surface treatment layer 214 g on the base board 212 is less than the base board 212 , and the orthogonal projection of the surface treatment layer 214 g on the base board 212 completely overlaps an orthogonal projection of the heat conductive layer 240 a on the base board 212 . The orthogonal projection of the surface treatment layer 214 g on the base board 212 completely overlaps an orthogonal projection of the reflective layer 230 a on the base board 212 and an orthogonal projection of the wavelength conversion layer 220 a on the base board 212 .
[0032]In this embodiment, since the surface treatment layer 214 g exhibits a reflective property, excitation light or by laser light leaked by the reflective layer 230 a may be reflected, so that light utilization efficiency is improved, and a layer in contact with the surface treatment layer 214 g may also be securely fixed. When being coated and formed on the surface treatment layer 214 g , the heat conductive layer 240 a may fill a surface and an inner portion of the surface treatment layer 214 g , so that the heat conduction effect provided by the surface treatment layer 214 g is further improved. In this way, the thermal energy generated by the wavelength conversion layer 220 a during excitation may be easily transmitted to the substrate 210 g.
[0033]FIG. 8 is a cross-sectional schematic view illustrating a wavelength conversion element according to another embodiment of the disclosure. With reference to FIG. 7 and FIG. 8 , a wavelength conversion element 200 h provided by this embodiment is similar to the wavelength conversion element 200 g provided by FIG. 7 , and a difference therebetween is that the heat conductive layer 240 c extends and covers the side surface S of the reflective layer 230 c and contacts the bottom surface B of the wavelength conversion layer 220 a in the direction D parallel to the optical axis of the excitation light of the wavelength conversion layer 220 a . Specifically, an orthogonal projection of the heat conductive layer 240 c on the base board 212 completely overlaps the orthogonal projection of the wavelength conversion layer 220 a on the base board 212 .
[0034]In the present embodiment, since the heat conductive layer 240 c may directly contact the bottom surface B of the wavelength conversion layer 220 a , the thermal energy generated by the wavelength conversion layer 220 a during excitation may be directly transmitted to a substrate 210 g , and that a favorable heat conduction effect is provided. In addition, since the heat conductive layer 240 c may directly contact the side surface S of the reflective layer 230 c , the thermal energy accumulated by the reflective layer 230 c may also be transmitted to the substrate 210 g from a lateral side, and that the heat conduction effect provided by the wavelength conversion element 200 h is further enhanced.
[0035]FIG. 9 is a cross-sectional schematic view illustrating a wavelength conversion element according to another embodiment of the disclosure. With reference to FIG. 7 and FIG. 9 , a wavelength conversion element 200 i provided by this embodiment is similar to the wavelength conversion element 200 g provided by FIG. 7 , and a difference therebetween is that in this embodiment, a substrate 210 i includes the base board 212 and a surface treatment layer 214 i , and an orthogonal projection of the surface treatment layer 214 i on the base board 212 completely overlaps the base board 212 . Therefore, the orthogonal projection of the heat conductive layer 240 a on the base board 212 is less than the base board 212 and completely overlaps the orthogonal projection of the reflective layer 230 a on the base board 212 and the orthogonal projection of the wavelength conversion layer 220 a on the base board 212 .
[0036]FIG. 10 is a cross-sectional schematic view illustrating a wavelength conversion element according to another embodiment of the disclosure. With reference to FIG. 9 and FIG. 10 , a wavelength conversion element 200 j provided by this embodiment is similar to the wavelength conversion element 200 i provided by FIG. 9 , and a difference therebetween is that the heat conductive layer 240 c extends and covers the side surface S of the reflective layer 230 c and contacts the bottom surface B of the wavelength conversion layer 220 a in the direction D parallel to the optical axis of the excitation light of the wavelength conversion layer 220 a . Specifically, the orthogonal projection of the heat conductive layer 240 c on the base board 212 is less than the base board 212 , and the orthogonal projection of the heat conductive layer 240 c on the base board 212 completely overlaps the orthogonal projection of the wavelength conversion layer 220 a on the base board 212 .
[0037]In the present embodiment, since the heat conductive layer 240 c may directly contact the bottom surface B of the wavelength conversion layer 220 a , the thermal energy generated by the wavelength conversion layer 220 a during excitation may be directly transmitted to a substrate 210 i , and that a favorable heat conduction effect is provided. In addition, since the heat conductive layer 240 c may directly contact the side surface S of the reflective layer 230 c , the thermal energy accumulated by the reflective layer 230 c may also be transmitted to the substrate 210 i from a lateral side, and that the heat conduction effect provided by the wavelength conversion element 200 j is further enhanced.
[0038]FIG. 11 is a cross-sectional schematic view illustrating a wavelength conversion element according to another embodiment of the disclosure. With reference to FIG. 9 and FIG. 11 , a wavelength conversion element 200 k provided by this embodiment is similar to the wavelength conversion element 200 i provided by FIG. 9 , and a difference therebetween is that the orthogonal projection of the surface treatment layer 214 i on the base board 212 completely overlaps the base board 212 and completely overlaps an orthogonal projection of a heat conductive layer 240 i on the base board 212 in this embodiment. Specifically, the orthogonal projection of the reflective layer 230 a on the base board 212 is less than the base board 212 and completely overlaps the orthogonal projection of the wavelength conversion layer 220 a on the base board 212 . Since the heat conductive layer 240 i is distributed on an entire substrate 210 i , so that thermal energy may be additionally diffused to a non-wavelength conversion region before being transmitted to the substrate 210 i . That is, an area of heat conduction to the substrate 210 i is expanded, so that the heat conduction effect is further enhanced.
[0039]FIG. 12 is a cross-sectional schematic view illustrating a wavelength conversion element according to another embodiment of the disclosure. With reference to FIG. 11 and FIG. 12 , a wavelength conversion element 200 l provided by this embodiment is similar to the wavelength conversion element 200 k provided by FIG. 11 , and a difference therebetween is that: a heat conductive layer 240 l extends and covers the side surface S of the reflective layer 230 c and contacts the bottom surface B of the wavelength conversion layer 220 a in the direction D parallel to the optical axis of the excitation light of the wavelength conversion layer 220 a . Specifically, the orthogonal projection of the wavelength conversion layer 220 a on the base board 212 is less than an orthogonal projection of the heat conductive layer 240 l on the base board 212 , and the orthogonal projection of the wavelength conversion layer 220 a on the base board 212 is greater than an orthogonal projection of the reflective layer 230 c on the base board 212 .
[0040]FIG. 13 is a cross-sectional schematic view illustrating a wavelength conversion element according to another embodiment of the disclosure. With reference to FIG. 7 and FIG. 13 , a wavelength conversion element 200 m provided by this embodiment is similar to the wavelength conversion element 200 g provided by FIG. 7 , and a difference therebetween is that the heat conductive layer 240 e extends and covers the first side surface 51 of the reflective layer 230 c and the second side surface S 2 of the wavelength conversion layer 220 e parallel to the optical axis of the excitation light in the direction D parallel to the optical axis of the excitation light of the wavelength conversion layer 220 e . Specifically, the orthogonal projection of the surface treatment layer 214 g on the base board 212 is less than the base board 212 and completely overlaps an orthogonal projection of the heat conductive layer 240 e on the base board 212 in this embodiment. In this case, the heat conductive layer 240 e may be distributed on the second side surface S 2 of the wavelength conversion layer 220 e , so that thermal energy generated by the wavelength conversion layer 220 e during excitation may be directly transmitted to the substrate 210 a , and that a favorable heat conduction effect is provided. In addition, since the heat conductive layer 240 e may directly contact the first side surface 51 of the reflective layer 230 c , the thermal energy accumulated by the reflective layer 230 c may also be transmitted to the substrate 210 g from a lateral side, and that the heat conduction effect provided by the wavelength conversion element 200 m is further enhanced.
[0041]FIG. 14 is a cross-sectional schematic view illustrating a wavelength conversion element according to another embodiment of the disclosure. With reference to FIG. 13 and FIG. 14 , a wavelength conversion element 200 n provided by this embodiment is similar to the wavelength conversion element 200 m provided by FIG. 13 , and a difference therebetween is that in this embodiment, the substrate 210 i includes the base board 212 and the surface treatment layer 214 i , the orthogonal projection of the surface treatment layer 214 i on the base board 212 completely overlaps the base board 212 , and the orthogonal projection of the heat conductive layer 240 e on the base board 212 is less than the base board 212 .
[0042]FIG. 15 is a cross-sectional schematic view illustrating a wavelength conversion element according to another embodiment of the disclosure. With reference to FIG. 14 and FIG. 15 , a wavelength conversion element 200 o provided by this embodiment is similar to the wavelength conversion element 200 n provided by FIG. 14 , and a difference therebetween is that the orthogonal projection of the surface treatment layer 214 i on the base board 212 completely overlaps the base board 212 and completely overlaps an orthogonal projection of a heat conductive layer 240 o on the base board 212 in this embodiment. Since the heat conductive layer 240 o is distributed on an entire substrate 210 i , so that thermal energy may be additionally diffused to a non-wavelength conversion region before being transmitted to the substrate 210 i . That is, an area of heat conduction to the substrate 210 i is expanded, so that the heat conduction effect is further enhanced.
[0043]FIG. 16 is a cross-sectional schematic view illustrating a wavelength conversion element according to another embodiment of the disclosure. With reference to FIG. 1B and FIG. 16 , a wavelength conversion element 200 p provided by this embodiment is similar to the wavelength conversion element 200 a provided by FIG. 1B , and a difference therebetween is that the wavelength conversion element 200 p provided by this embodiment further includes an adhesive layer 250 disposed on the substrate 210 a and located between the wavelength conversion layer 220 a and the reflective layer 230 a . Note that the adhesive layer 250 provided in FIG. 16 may be additionally added to FIG. 1B to FIG. 15 , so that bonding between the wavelength conversion layer and the reflective layer is enhanced, which still belongs to the protection scope of the disclosure.
[0044]In view of the foregoing, the embodiments of the disclosure have at least one of the following advantages or effects. In the design of the wavelength conversion element provided by the disclosure, at least a portion of the heat conductive layer is located between the substrate and the reflective layer. In this way, the thermal conductivity of the wavelength conversion element is increased, and that conversion efficiency of the wavelength conversion element is further enhanced. In addition, the projector adopting the wavelength conversion element provided by the disclosure may feature favorable projection quality and product competitiveness.
[0045]The foregoing description of the preferred embodiments of the invention has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form or to exemplary embodiments disclosed. Accordingly, the foregoing description should be regarded as illustrative rather than restrictive. Obviously, many modifications and variations will be apparent to practitioners skilled in this art. The embodiments are chosen and described in order to best explain the principles of the invention and its best mode practical application, thereby to enable persons skilled in the art to understand the invention for various embodiments and with various modifications as are suited to the particular use or implementation contemplated. It is intended that the scope of the invention be defined by the claims appended hereto and their equivalents in which all terms are meant in their broadest reasonable sense unless otherwise indicated. Therefore, the term “the invention”, “the present invention” or the like does not necessarily limit the claim scope to a specific embodiment, and the reference to particularly preferred exemplary embodiments of the invention does not imply a limitation on the invention, and no such limitation is to be inferred. The invention is limited only by the spirit and scope of the appended claims. The abstract of the disclosure is provided to comply with the rules requiring an abstract, which will allow a searcher to quickly ascertain the subject matter of the technical disclosure of any patent issued from this disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. Any advantages and benefits described may not apply to all embodiments of the invention. It should be appreciated that variations may be made in the embodiments described by persons skilled in the art without departing from the scope of the present invention as defined by the following claims. Moreover, no element and component in the present disclosure is intended to be dedicated to the public regardless of whether the element or component is explicitly recited in the following claims.
