In view of the deficiency of the existing research on the energy absorption characteristics of composite multi-cell structures, a kind of multicellular filling structure (MFS) was proposed, which was filled by some single small-size CFRP tubes (SCT) into large-size CFRP tubes. The quasi-static compression tests of SCT and MFS were carried out, which included full stroke compression and multi-staged compression, then the failure mode and energy absorption characteristics were analyzed. The results show that the failure mode of the outermost CFRP tube of MFS is similar to SCTs, and there is no obvious difference between full stroke compression and multi-staged compression, but the radial deformation of the outermost tube is obvious due to the compression of the inner tube and debris. Compared with the full stroke compression process, the total energy absorption of SCT and MFS is more when they are multi-staged compressed. In this study, the maximum specific energy absorption (SEA) of SCT is 86.0 J/g and the minimum SEA is 59.3 J/g. While, due to the low SEA of the outermost tube of filled structures, the SEA of the MFS is between 69.8 J/g and 75.9 J/g, which is less than the maximum SEA of SCT. The SEA of the MFS is higher than that of SCT with appropriate external constraint and internal carbon tube number by further research.
Nomex honeycomb and smart self-adhesive prepreg were used to manufacture honeycomb sandwich panels with uniform platen by co-curing process in autoclave. Climbing drum peel test was used to measure their peel strength, and scanning electron microscope was used to observe micromorphology of bonding interface of skin-honeycomb, and the structure of the skin surface after peel and cellular wall ends. Moreover, thickness of cellular wall and composition of impregnated resin were also measured.combined with the above test results, effects of processing parameters and character of cellular wall ends on the peel strength of honeycomb sandwich panels were studied and types of the adhesive bonding between skin and core were also investigated. It is found that the bond strength increases with the decrease of the temperature ramp rate within a certain range during the co-curing process with uniform platen. However, the pressure-applied moment has no significant effect on bond strength between the skin and core. The honeycomb sandwich panel has higher bond strength when the cellular wall end is rougher or the thickness of the resin layer on the cellular wall is smaller.
Nomex honeycomb and smart self-adhesive prepreg were used to manufacture honeycomb sandwich panels with uniform platen by co-curing process in autoclave.Climbing drum peel test was used to measure their peel strength,and scanning electron microscope was used to observe micromorphology of bonding interface of skinhoneycomb,and the structure of the skin surface after peel and cellular wall ends.Moreover,thickness of cellular wall and composition of impregnated resin were also measured.Combined with the above test results,effects of processing parameters and character of cellular wall ends on the peel strength of honeycomb sandwich panels were studied and types of the adhesive bonding between skin and core were also investigated.It is found that the bond strength increases with the decrease of the temperature ramp rate within a certain range during the co-curing process with uniform platen.However,the pressure-applied moment has no significant effect on bond strength between the skin and core.The honeycomb sandwich panel has higher bond strength when the cellular wall end is rougher or the thickness of the resin layer on the cellular wall is smaller.
The thermal conductivities of carbon fiber/epoxy prepreg,in the directions of perpendicular and parallel to the fiber direction,were determined during its curing process by modulated differential scanning calorimetry(MDSC).During the carbon fiber/epoxy prepreg curing process the binary quadratic function models of thermal conductivity in different directions were set up based on the experimental results,which was used to determine the value of thermal conductivity with the temperature and the cure degree during the curing process.The results show that the thermal conductivity of the T800/epoxy prepreg is 0.85~1.25 W/(m·K) and 1.15~1.40 W/(m·K) in the directions of perpendicular and parallel to the fiber direction.The thermal conductivity of the prepreg decreases with the degree of cure at the same temperature,and increases with increasing temperature in the same degree of cure.The verification results show that the binary quadratic function model of the thermal conductivity will improve the accuracy of the parameters in numerical simulation.