Effects of copper sulfate concentration,complexing agent concentration ratio,formaldehyde concentration,rare earth content and temperature on copper deposition rate,coating microstructure of electroless copper plating on ceramic were discussed.Results showed that with the increase in copper sulfate concentration and temperature and decrease in complexing agent ratio,the Cu deposition rate was increased but bath stability decreased;with increasing formaldehyde concentration and rare earth content,the Cu deposition rate was increased at first and then decreased.By adding rare earth Ce salt,copper particles got refined and copper depositon became even,especially when cerium sulfate content was 0.8g/L,copper coating became more level,finer and less pores.

The optimum electric voltage,time,temperature of sulfuric acid-boric acid anodic oxidation electrolyte for aluminum alloy were obtained by orthogonal experiment,and then different amounts of cerous sulfate were added in the optimum electrolyte.The corrosion resistance of aluminum alloy anodizing film obtained from these electrolytes was determined by salt spray and immersion tests and polarization curve measurement.The content of cerous sulfate was optimized.

The corrosion resistance,wearing resistance,hardness of aluminum alloy substrate were greatly improved by aluminum alloy anodic oxidation technology.Anodic oxidized films with different properties were obtained in different acid solution processes.In this review,the crafts of anodic oxidation in conventional acidic electrolyte were summarized,especially the process and development of sulfuric acid-boric acid anodic oxidation.The trend of anodic oxidation technology was briefly pointed out.