The aim of the article is to present new developments in microultrasonic machining concerning design and manufacture of a complete acoustic system optimized for ultraprecise processing on 2-in. wafer and examples of microstructures produced at FEMTO-ST institute, particularly in piezoelectric materials. The potentialities and the limitations of the ultrasonic machining technique are discussed. The choice and the dimensions of the material for the acoustic transducer were defined through finite element modeling. Other parameters affecting the machining process such as static load of the tool, vibration amplitude, grain material and size of the abrasive slurry, and workpiece characteristics were hierarchized experimentally in order to increase machining quality (surface state, precision) and minimize tool wear.

Ultrasonic machining (USM) presents a particular interest for the cutting of non-conductive, brittle materials such as ceramics, glasses or fused silica and quartz crystal. Unlike other non-traditional processes such Electrical Discharge Machining (EDM and micro-EDM, adapted to conductive materials), laser ablation or wet chemical etching, USM does not thermally damage the workpiece and does not create significant levels of stresses. Production of complex 3-D shapes with a volume of a few cubic millimeters is presented.