We describe the design of the cryogenic packaging and testing of the Sensor Chip Electronics (SCE) delivered to the Near-Infrared Spectro-Photometer (NISP) instrument for the ESA Euclid mission. The Euclid mission will observe 15 000 deg2 of extragalactic sky1 from the Sun{Earth Lagrange point L2. The payload of the Euclid spacecraft consists of a telescope with 1.2m SiC primary mirror, passively cooled to ~ 125 K, and two focal plane instruments, the visible instrument (VIS) and NISP. At the heart of the NISP instrument is a 4 x 4 mosaic focal plane of Teledyne H2RG infrared detector arrays held at 100K linked using a cryogenic ex cable (CFC) to the SCE at as low as 130 K. The SCE uses the Teledyne SIDECAR Application Specific Integrated Circuit (ASIC) to provide timing, biases, communications, and data conversion for operation of the HAWAII 2 RG (H2RG) Sensor Chip Assembly (SCA) and interfaces to the NISP warm electronics. The SIDECAR ASIC is mounted onto a Silicon Fanout (SiFO) and Invar table support structure and then wirebonded to a printed wiring board assembly (PWB) with passive components and 91-pin nanoconnectors. The PWB is housed within an enclosure which serves as the mechanical and thermal interface to the NISP Support Structure. The qualification and flight SCE were assembled and subjected to environmental testing at the Jet Propulsion Laboratory and then calibrated and tested with the flight lot SCA and CFC at Goddard Space Flight Centers Detector Characterization Lab. The results of the qualification and reliability tests as well as the measured characteristics of the flight SCE will be summarized.

We describe the design and testing of the Cryogenic Flex Cable (CFC) delivered for the Near-Infrared Spectro-Photometer (NISP) instrument [1] for the ESA Euclid mission [2, 3]. The Euclid spacecraft is scheduled for launch in the summer of 2022. It will observe similar to 1/3 of the total sky using a telescope with 1.2m SiC primary mirror, passively cooled to similar to 125K, and containing Visible Imager (VIS) [4] and NISP focal plane instruments, from an orbit at the Earth-Sun L2 lagrange point. At the heart of the NISP instrument is a 4X4 mosaic focal plane of Teledyne H2RG infrared detector arrays held at 100K. The CFC described here are designed to link each detector array to a dedicated packaged cryogenic electronics assembly held at similar to 137K with minimal heat leak to the 100K stage and to withstand handling and launch vibrations. Prototype CFCs were developed and tested by Teledyne. The final 7-layer CFC flexible printed circuit boards and Airborn nanoconnectors were provided by Teledyne and assembled for flight at the Jet Propulsion Lab (JPL). Flight qualification CFC were made and subjected to thermal conductance, thermal emissivity, thermal cycle, survivability to bend, vibration and normal mode testing at JPL. The flight CFC were subject to bake out and thermal cycle at JPL and then tested with the flight detectors and electronics at Goddard Space Flight Centers Detector Characterization Lab. The results of the qualification tests as well as the measured characteristics of the 41 manufactured CFC are summarized.