Elliptical vibration cutting (EVC) has been widely concerned since it was proposed, and its unique characteristics such as friction reversal and intermittent cutting can effectively extend the tool life, improve the machined surface roughness and so on. The objective of this paper was to predict the behavior of cutting force. A method of predicting the behavior of cutting force based on the chip thickness under various cutting conditions is proposed. Based on the established tool motion model, the chip model was founded. By numerical simulation, the effects of cutting parameters on cutting force under various cutting conditions were studied. The results show that the chip thickness can be used to predict the behavior of cutting force.

A novel three-dimensional (3D) elliptical vibration turning device which is on the basis of the leaf-spring-flexure-hinges-based (LSFH-based) double parallel four-bar linkages (DPFLMs) has been proposed. In order to evaluate the performance of the developed 3D elliptical vibration cutting generator (EVCG), the off-line tests were carried out to investigate the stroke, dynamic performance, resolution, tracking accuracy and hysteresis along the three vibration axes. Experimental results indicate that the maximum stroke of three vibration axes can reach up to 26 μm. The working bandwidth can reach up to 1889 Hz. The resolution and hysteresis tests show that the developed 3D EVCG has a good tracking accuracy, relative high resolution and low hysteresis, which is appropriate for micro/nano machining. Kinematical modeling is carried out to investigate the tool vibration trajectory. Experimental results shown that the simulation results agree well with the experimental one, which indicate that the developed 3D EVCG can be used as an option for micro/nano machining.