This work addresses the mechanics of debonding along copper/epoxy joints featuring patterned interfaces. Engineered surface heterogeneities with enhanced adhesion properties are generated through pulsed laser irradiation. Peel tests are carried out to ascertain the effect of patterns shape and area fraction on the mechanical response. Experimental results are evaluated with the support of three-dimensional finite element simulations based on the use of cohesive surfaces. Results discussion is largely framed in terms of effective peel force and energy absorbed to sever the samples. It is shown that surface heterogeneities act as sites of potential crack pinning able to trigger crack initiation, propagation and arrest. Surface patterns ultimately enable a remarkable increase in the effective peel force and dissipated energy with respect to baseline homogeneous sanded interface.

The purpose of the present work is to analyze the effect of pulsed laser ablation on copper substrates (CuZn40) deployed for adhesive bonding. Surface pre-treatment was carried using an Yb-fiber laser beam. Treated surfaces were probed using Scanning Electron Microscopy (SEM) and X-Ray Photoelectron Spectroscopy (XPS). The mechanical performance of CuZn40/epoxy bonded joints was assessed using the T-peel test coupon. In order to resolve the mechanisms of failure and adhesive penetration within surface asperities induced by the laser treatment, fracture surfaces were surveyed using SEM. Finite element simulations, based on the use of the cohesive zone model of fracture, were carried out to evaluate the variation of bond toughness. Results indicated that the laser ablation process effectively modifies surface morphology and chemistry and enables enhanced mechanical interlocking and cohesive failure within the adhesive layer. Remarkable improvements of apparent peel energy and bond toughness were observed with respect to control samples with sanded substrates.