The primary goals of the present study are to: (1) determine how and why MEMS-scale friction differs from friction on the macro-scale, and (2) to begin to develop a capability to perform finite element simulations of MEMS materials and components that accurately predicts response in the presence of adhesion and friction. Regarding the first goal, a newly developed nanotractor actuator was used to measure friction between molecular monolayer-coated, polysilicon surfaces. Amontons law does indeed apply over a wide range of forces. However, at low loads, which are of relevance to MEMS, there is an important adhesive contribution to the normal load that cannot be neglected. More importantly, we found that at short sliding distances, the concept of a coefficient of friction is not relevant; rather, one must invoke the notion of 'pre-sliding tangential deflections' (PSTD). Results of a simple 2-D model suggests that PSTD is a cascade of small-scale slips with a roughly constant number of contacts equilibrating the applied normal load. Regarding the second goal, an Adhesion Model and a Junction Model have been implemented in PRESTO, Sandia's transient dynamics, finite element code to enable asperity-level simulations. The Junction Model includes a tangential shear traction that opposes the relativemore » tangential motion of contacting surfaces. An atomic force microscope (AFM)-based method was used to measure nano-scale, single asperity friction forces as a function of normal force. This data is used to determine Junction Model parameters. An illustrative simulation demonstrates the use of the Junction Model in conjunction with a mesh generated directly from an atomic force microscope (AFM) image to directly predict frictional response of a sliding asperity. Also with regards to the second goal, grid-level, homogenized models were studied. One would like to perform a finite element analysis of a MEMS component assuming nominally flat surfaces and to include the effect of roughness in such an analysis by using a homogenized contact and friction models. AFM measurements were made to determine statistical information on polysilicon surfaces with different roughnesses, and this data was used as input to a homogenized, multi-asperity contact model (the classical Greenwood and Williamson model). Extensions of the Greenwood and Williamson model are also discussed: one incorporates the effect of adhesion while the other modifies the theory so that it applies to the case of relatively few contacting asperities.« less

Polycrystalline silicon (polysilicon) surface micromachining is a new technology for building micrometer (μm) scale mechanical devices on silicon wafers using techniques and process tools borrowed from the manufacture of integrated circuits. Sandia National Laboratories has invested a significant effort in demonstrating the viability of polysilicon surface micromachining and has developed the Sandia Ultraplanar Micromachining Technology (SUMMiT V) process, which consists of five structural levels of polysilicon. A major advantage of polysilicon surface micromachining over other micromachining methods is that thousands to millions of thin film mechanical devices can be built on multiple wafers in a single fabrication lot and will operate without post-processing assembly. However, if thin film mechanical or surface properties do not lie within certain tightly set bounds, micromachined

Polycrystalline silicon (polysilicon) surface micromachining is a new technology for building micrometer ({micro}m) scale mechanical devices on silicon wafers using techniques and process tools borrowed from the manufacture of integrated circuits. Sandia National Laboratories has invested a significant effort in demonstrating the viability of polysilicon surface micromachining and has developed the Sandia Ultraplanar Micromachining Technology (SUMMiT V{trademark} ) process, which consists of five structural levels of polysilicon. A major advantage of polysilicon surface micromachining over other micromachining methods is that thousands to millions of thin film mechanical devices can be built on multiple wafers in a single fabrication lot and will operate without post-processing assembly. However, if thin film mechanical or surface properties do not lie within certain tightly set bounds, micromachined devices will fail and yield will be low. This results in high fabrication costs to attain a certain number of working devices. An important factor in determining the yield of devices in this parallel-processing method is the uniformity of these properties across a wafer and from wafer to wafer. No metrology tool exists that can routinely and accurately quantify such properties. Such a tool would enable micromachining process engineers to understand trends and thereby improve yield of micromachined devices. In this LDRD project, we demonstrated the feasibility of and made significant progress towards automatically mapping mechanical and surface properties of thin films across a wafer. The MEMS parametrics measurement team has implemented a subset of this platform, and approximately 30 wafer lots have been characterized. While more remains to be done to achieve routine characterization of all these properties, we have demonstrated the essential technologies. These include: (1) well-understood test structures fabricated side-by-side with MEMS devices, (2) well-developed analysis methods, (3) new metrologies (i.e., long working distance interferometry) and (4) a hardware/software platform that integrates (1), (2) and (3). In this report, we summarize the major focus areas of our LDRD project. We describe the contents of several articles that provide the details of our approach. We also describe hardware and software innovations we made to realize a fully automatic wafer prober system for MEMS mechanical and surface property characterization across wafers and from wafer-lot to wafer-lot.

A new surface-micromachined actuator, the torsional ratcheting actuator (TRA), has been characterized and stress tested for reliability. The most prominent failure mechanism when running at high speeds (ratcheting frequencies of 333, 1000, or 3000 Hz) is wear on rubbing surfaces leading to adhesion between the ring gear and the alignment guide. We have also observed failure when running at low speeds (5 Hz) due to misalignment of the ring gear, preventing the ratchet pawl from engaging. A wear model was developed which closely predicts the normal force promoting the wear and is in agreement with supporting calculations. We observed multiple ratcheting in the TRA during calibration and solved the equations of motion to confirm that it was due to the moment of inertia of the large ring gear. Damping was also shown to have an effect

By integrating interferometric deflection data from electrostatically actuated microcantilevers with a numerical finite difference model, we have developed a step-by-step procedure to determine values of Young's modulus while simultaneously quantifying nonidealities. The central concept in the methodology is that nonidealities affect the long-range deflections of the beams, which can be determined to near nanometer accuracy. Beam take-off angle, curvature and support post compliance are systematically determined. Young's modulus is then the only unknown parameter, and is directly found. We find an average value of Young's modulus for polycrystalline silicon of 164.3 GPa and a standard deviation of 3.2 GPa (/spl plusmn/2%), reflecting data from three different support post designs. Systematic errors were assessed and may alter the average value by /spl plusmn/5%. An independent estimate from grain orientation measurements yielded 163.4-164.4 GPa (the Voigt and Reuss bounds), in agreement with the step-by-step procedure. Other features of the test procedure include that it is rapid, nondestructive, verifiable and requires only a small area on the test chip.

In this paper we describe optical and dynamic performance of tip/tilt micromachined mirrors fabricated using the SUMMIT V(TM) surface micromachining process. We find that the tilt angle for a given mirror design is determined by a combination of geometric factors and stiffness of the capacitive suspension. Switching speeds of similar to40-50 tsec are measured for 50 pm-square mirrors. Finally surface roughness and curvature before and after metallization are obtained using white light interferometry.

In this paper we describe optical and dynamic performance of tip/tilt micromachined mirrors fabricated using the SUMMIT V surface micromachining process. We find that the tilt angle for a given mirror design is determined by a combination of geometric factors and stiffness of the capacitive suspension. Switching speeds of ~40-50 microsecond(s) econds are measured for 50 micrometers -square mirrors. Finally surface roughness and curvature before and after metallization are obtained using white light interferometry.

A new type of surface micromachined ratcheting actuation system has been developed at the Microelectronics Development Laboratory at Sandia National Laboratories. The actuator uses a torsional electrostatic comb drive that is coupled to an external ring gear through a ratcheting scheme. The actuator can be operated with a single square wave, has minimal rubbing surfaces, maximizes comb finger density, and can be used for open-loop position control. The prototypes function as intended with a minimum demonstrated operating voltage of 18V. The equations of motion are developed for the torsional electrostatic comb drive. The resonant frequency, voltage vs. displacement and force delivery characteristics are predicted and compared with the fabricated device's performance.

We have designed, fabricated, tested and modeled a first generation small area test structure for MEMS fracture studies by electrostatic rather than mechanical probing. Because of its small area, this device has potential applications as a lot monitor of strength or fatigue of the MEMS structural material. By matching deflection versus applied voltage data to a 3-D model of the test structure, we develop high confidence that the local stresses achieved in the gage section are greater than 1 GPa. Brittle failure of the polycrystalline silicon was observed.

Micromachined beams are commonly used to measure material properties in MEMS. Such measurements are complicated by the fact that boundary effects at the ends of the beams have a significant effect on the properties being measured. In an effort to improve the accuracy and resolution of such measurements, we are conducting a study of support post compliances in cantilever and fixed-fixed beams. Three different support post designs have been analyzed by finite element modeling. The results are then compared to measurements made on actual devices using interferometry. Using this technique, the accuracy of measurements of Young's modulus has been improved. Continuing work will also improve the measurement of residual stress.

Recent research on the energy finite element method (EFEM) has focused on the development of structural–acoustic coupled capability. This formulation has been developed successfully in terms of radiation efficiency. The approach has been implemented into the finite element method and successfully verified against experimental results for an enclosure with one flexible wall. Calculation of the sensitivity of the response to various parameters of the model is reasonably straightforward in the EFEM formulation. This capability was used for system identification for the experimental verification problem and for understanding the dominant mechanisms which govern the structural acoustic response at high frequency for both acoustical and mechanical excitation of the enclosure problem. [See NOISE-CON Proceedings for full paper.]

A new numerical method, referred to as the energy finite element method, had been previously developed to predict the high-frequency response of built-up structural acoustic systems consisting of subsystems such as rods, beams, plates, and acoustic spaces. The methodology for prediction of behavior in the subsystems is based on a diffuse energy field approximation. Subsystems are coupled together using net energy flow and energy superposition principles. In this paper, the structural acoustic coupling relationship for energy flow analysis of coupled plates and acoustical spaces is shown. The coupling approach chosen for structural acoustic radiation uses plate radiation efficiency. The approach has been implemented into an energy finite element model. The energy finite element predictions will be compared to measured results for an acoustical enclosure with one flexible wall.