Background: Nanoporous copper (NPC) is one of the attractive inexpen- sive nanoporous materials with prospects for many applications such as catalyst, electronics and package. A unique approach to fabricate NPC films and patterned NPC films on various substrates was reported. It will have important implications for fabricating novel microsensors with more complex porous structures from multi- phase alloy families. Keywords: Arrays, chemical dealloying, electrodeposited CuZn alloy, fabrication, nanoporous copper films, surface area.

使用Fluent流场仿真软件模拟了电镀液对硅通孔(TSV)的浸润过程,讨论了TSV深宽比、电镀液流速、电镀液表面张力、接触角以及压强等因素对TSV浸润过程的影响.通过对比仿真寻找出能在电镀之前使电镀液完全浸润TSV所有表面的预润湿处理方法,以防止因润湿不彻底在TSV底部形成气泡而导致的有空洞电镀填充.通过仿真发现,电镀液表面张力越小,电镀液与待电镀样片表面的接触角越小,浸润过程中电镀液的流速越慢,浸润所处环境的压强越低,则越有利于电镀液对TSV的浸润;且流速为0.002m/s时即可对深宽比低于或等于130 μm∶30μm的TSV实现完全浸润;浸润环境压强低于3 000 Pa时即可在流速为0.05 m/s时对深宽比为150 μm∶50 μm的TSV基本实现完全浸润.当TSV结构的深宽比大于2的时候,没有经过预润湿而直接放入电镀液的TSV结构很难实现无空洞电镀填充.

主要研究了一种适用于微加工工艺的纳米多孔铜(NPC)制备方法.采用酸性柠檬酸铜锌电镀体系制备出Cu68Zn32前驱合金,通过改变前驱合金在盐酸中去合金的时间可以对NPC的微观形貌及孔径分布进行有效控制.研究结果表明,在0.05 mol/L的盐酸中腐蚀6h后制备的NPC孔径为80～120 nm,而系带尺寸为20～40呦,利用BET法测得其比表面积为8.12 m2/g.另外,应用微加工工艺制备出边长为50 μm方形微阵列,验证了该NPC制备工艺与微加工工艺有较好的兼容性,为NPC的图形化与集成制造提供一种有效的工艺方案.

Graphic nanoporous copper (NPC) was prepared by a new method. Cu68Zn32 and Cu36Zn64 (atomic percentages) precursor alloy thin film was deposited by electro-deposition in acidic alloy plating solution and then dealloyed in hydrochloric acid to fabricate nanoporous copper (NPC) with pore size from 30nm to 100nm. The results show that the microstructure of NPC can be controlled by changing alloy plating solution and dealloying process, this process also maintains compatibility with micro-fabrication technique.