The electrical and ferroelectric properties with different amounts of chemical bonding states at the polymer/metal interface were examined quantitatively in a ferroelectric copolymer poly(vinylidene fluoride-trifluoroethylene) film sandwiched between the top and bottom electrodes on which the surface had been modified by rapid thermal processing in a N2 atmosphere. The capacitors with the heat-treated bottom electrodes at different temperatures showed a lower charge storing capacitance. Ultraviolet photoelectron spectroscopy showed that the capacitance enhancement and field shift to lower coercive value resulted from the relatively larger increase in anions (N,O) than cations (Ti) and the reduction of NC bonding in the reaction product (TiNxOy) on the surface of the bottom electrode, respectively.
The metal-ferroelectric-metal-insulator-semiconductor field-effect transistor using the Au/(Bi,La)(4)Ti3O12(BLT)/Pt/SrTa2O6(STA)/Si structure is prepared. The STA and BLT films are spun-casted by the sol-gel method. The equivalent oxide thickness value of the STA thin film is 5.2 nm and negligibly small hysteresis loops have been observed for the Au/STA/Si structure. The leakage current density is lower than 10(-7) A/cm(2) under 6 V. The remanent polarization of the 420 nm-thick BLT film was 35.2 mu C/cm(2) at 450 kV/cm. The Au/BLT/Pt/STA/Si MFMIS-FET was fabricated with different area ratio (A(I)/A(F)) from 1 to 8. From the drain current-gate voltage characteristics at the drain voltage of 0.2 V, the memory window is only 0.5 V for the device with A(I)/A(F) = 1 but it is increased to 1.8 V as the AI/AF is increased to 8. For the AI/AF ratio of 4, the drain current of 1.2 x 10(-5) A rapidly drops after 1.4 x 10(4) s to 4 x 10(-6) A. The retention time improves as the AI/AF ratio is increased to 8 and it has been found to drop after 8.5 x 10(4) seconds.
The home network is expected to experience significant growth over next few years, as wireless and ubiquitous networking becomes more common and accessible. However, the broadcast nature of this technology creates new security issues. To ensure the effective deployment in home environments, network security must reach a certain level which is reasonably acceptable to the research community. The security mechanism for home networks must not require heavy computations, since usually consist of low CPUs capable, limited memory and storage, and mobility concerns. This paper presents a secure authentication and session key establishment mechanism suitable for home networks. The proposed scheme is based on the Secure Remote Password (SRP) protocol. The performance evaluation demonstrates that our proposed mechanism is more secure than previous ones while maintaining the similar level of security overhead including processing time.
For providing mobility services for users through the global Internet, Mobile IP (MIP) has been standardized by IETF. Since conventional MIP has been investigated without the support of the security, IETF suggests that the current servers capable of performing the authentication, authorization, and accounting (AAA) be used for secure services. However the quality of service (QoS) may be degraded due to inefficiency on integrating the conventional MIP and AAA. For this, we propose a fast and secure handoff mechanism based on IDentification Key (IDK) along with Authentication Value (AV). Also we evaluate the performance of the proposed scheme in terms of the probability of handoff failure and average latency. The results show that our proposed mechanism yields better performance than session key exchange mechaism [11] and ticket based one [12] while maintaining the similar level of security.
Mobile IP proposed by IETF supports continuous services for a mobile node (MN) based on its capability to roam around foreign domains [1]. Recently the rapid growth of wireless technology and its use in coordination with the Internet require a very careful look at issues regarding the security. As a large portion of 785-million world Internet users access such technologies in the context of providing security demanded services, it is essential to recognize the potential threats in wireless technologies. For this reason, IETF suggests that the existence of some servers capable of performing the authentication, authorization, accounting (AAA) services could help [4, 5, 6, 7]. In this paper, we propose an Extended IDentification Key (EIDK) mechanism based on IDK with Authentication Value (AV) that can reduce the number of signaling messages and thus signaling delay for services even in handoffs while maintaining the similar level of security to the previous works [10, 11]. The performance results obtained show that this method can provides a good solution to secure service procedures in mobile computing.
Quality of service (QoS) and security in Mobile IP networks are becoming significant issues due to an increasing number of wireless devices[1]. For this reason, the Hierarchical Mobile IPv6 (HMIPv6) protocol[2] and the Authentication, Authorization, and Accounting (AAA) protocol[3] are proposed. However this protocol has inefficient authenticating and binding update procedures that limit its QoS. In this paper, we propose a forwarding scheme extension for fast and secure handoff that can reduce a handoff delay while maintaining a security level by a forwarding and session key exchange mechanism. The performance results show that the proposed mechanism reduces the handoff latency up to 10% and the handoff failure rate up to 25% compared to the previous mechanism.