Replacing the bulky cryoliquid-based cooling stages of cryoenabled instruments by chip-scale refrigeration is envisioned to disruptively reduce the system size similar to microprocessors did for computers. Electronic refrigerators based on superconducting tunnel junctions have been anticipated to provide a solution, but reaching the necessary above the 1-K operation temperature range has remained a goal out of reach for several decades. We show efficient electronic refrigeration by Al-AlOx-Nb superconducting tunnel junctions starting from bath temperatures above 2 K. The junctions can deliver electronic cooling power up to approximately mW/mm2, which enables us to demonstrate tunnel-current-driven electron temperature reduction from 2.4 K to below 1.6 K (34% relative cooling) against the phonon bath. Our work shows that the key material of integrated superconducting circuits-niobium-enables powerful cryogenic refrigerator technology. This result is a prerequisite for practical cryogenic chip-scale refrigerators and, at the same time, it introduces a new electrothermal tool for quantum heat-transport experiments.

We fabricate and characterize superconducting through-silicon vias and electrodes suitable for superconducting quantum processors. We measure internal quality factors of a million for test resonators excited at single-photon levels, on chips with superconducting vias used to stitch ground planes on the front and back sides of the chips. This resonator performance is on par with the state of the art for silicon-based planar solutions, despite the presence of vias. Via stitching of ground planes is an important enabling technology for increasing the physical size of quantum processor chips and is a first step toward more complex quantum devices with 3-D integration.