We report the first direct diode laser module integrated with a trepanning optic for remote oscillation welding. The trepanning optic is assembled with a collimated DirectProcess 900 laser engine. This modular laser is based on single emitters and beam combiners to achieve fiber coupled modules with a beam parameter product or BPP < 8 mm mrad at all power levels up to 1 kW, as well as free space collimated outputs with even lower BPP. The initial design consists in vertically stacking several diodes in the fast axis which leads to a rectangular output of about 100 W with BPP of <3.5 mm*mrad in the fast axis and <5 mm*mrad in the slow axis. Next, further power scaling is accomplished by polarization combining and wavelength multiplexing yielding high optical efficiencies of more than 80% and resulting in a building block module with over 500 W launched into a 100 μm fiber with 0.15 NA. The beam profile of the free space module remains rectangular, with a nearly flat top and conserves the beam parameter product of the original vertical stack without the power loss of fiber coupling. The 500 W building blocks feature a highly flexible emitting wavelength bandwidth. New wavelengths can be configured by simply exchanging parts and without modifying the production process. This design principle provides the option to adapt the wavelength configuration to match a broad set of applications, from the UV to the visible and to the far IR depending on the commercial availability of laser diodes. This opens numerous additional applications like laser pumping, scientific and medical applications, as well as materials processing applications such as cutting and welding of copper aluminum or steel. Furthermore, the module’s short lead lengths enable very short pulses. Integrated with electronics, the module’s pulse width can be adjusted from micro-seconds to cw mode operation by simple software commands. An optical setup can be directly attached instead of a fiber to the laser module thanks to its modular design. This paper’s experimental results are based on a trepanning optic attached to the laser module. Alltogether the setup approximately fits in a shoe box and weighs less than 20 kg which allows for direct mounting onto a 3D-gantry system. The oscillating weld performance of the 500 W direct diode laser utilizing a novel trepanning optic is discussed for its application to aluminum/aluminum and aluminum/copper joints.

To exploit the advantages of laser technology for micro machining, versatile trepanning systems based on rotating optics have been designed and implemented by LMTB. The advanced trepanning systems enable the controlled adjustment of beam displacement and inclination during operation to drill through-holes with arbitrary geometry. With a patented measuring device, the angular position of the rotating optics is determined online. This paper outlines the development steps and advanced performance, accenting laser micro machining of up to 1 mm thick metal. It discusses also the feasibility of different tapered through holes with an entrance diameter in the range of 65 to 1000μm.

Drilling of micro through-holes in defined geometry, i.e. entrance diameter and taper, is gaining in importance in different fields of application and production. To exploit the advantages of laser technology for micro machining, versatile trepanning systems based on rotating optics have been designed and implemented. The advanced trepanning systems enable the controlled adjustment of beam displacement and inclination during operation. With a patented measuring device, the angular position of the rotating optics is determined online. The presented compact and low-weight trepanning systems can drill differently tapered through-holes with a diameter in a range of 50 to 1500 mu m. Various solid-state laser sources have been used in combination with the presented laser trepanning system for material ablation. The wavelength und pulse width range from 355 to 1550 nm and sub-ps to 100 ns. The novel trepanning systems have been customized for different applications, ranging from basic research quest to industrial production. This presentation outlines the development steps and application results, accenting laser micro drilling of up to 1 mm thick metal and dielectric samples.

New laser processing strategies in micro processing of glass, quartz and other optically transparent materials are being developed with increasing effort. Utilizing diode-pumped solid-state laser generating nanosecond pulsed green (532 nm) laser light in conjunction with either scanners or special trepanning systems can provide for reliable glass machining at excellent efficiency. Micro ablation can be induced either from the front or rear side of the glass sample. Ablation rates of over 100 μm per pulse can be achieved in rear side processing. In comparison, picosecond laser processing of glass and quartz (at a wavelength of 1064 or 532 nm) yield smaller feed rates at however much better surface and bore wall quality. This is of great importance for small sized features, e.g. through-hole diameters smaller 50 μm in thin glass. Critical for applications with minimum micro cracks and maximum performance is an appropriate distribution of laser pulses over the work piece along with optimum laser parameters. Laser machining tasks are long aspect micro drilling, slanted through holes, internal contour cuts, micro pockets and more complex geometries in e.g. soda-lime glass, B33, B270, D236T, AF45 and BK7 glass, quartz, and Zerodur.

The implementation of laser processing strategies and working tools for micro cylindrical drilling at high aspect ratio is demonstrated for glasses, ceramics and metals. Laser parameters vary in wavelength, pulse width and pulse energy.

Ultra-short laser pulses find numerous industrial applications, e. g. material processing. High peak power induces non-linear optical effects, yielding additional potential for fabrication quests as internal structuring, precision drilling, processing of wafers and thin films.

A versatile laser trepanning system has been designed and implemented, enabling rapid circular beam steering and fast adjustment of beam displacement and inclination. The presented trepanning systems drill differently tapered through-holes with a diameter in a range of 50 to 1500 µm. The novel trepanning systems have been customized for different applications, ranging from basic research to industrial production. The development steps, laser parameters and advanced performance are outlined, accenting laser micro machining of up to 1 mm thick metal and ceramic samples.

A versatile laser trepanning system has been designed and implemented to enable the adjustment of circular beam displacement and inclination during the rotation of the optics. The presented systems drill differently tapered through-holes with a diameter in the range of 50 to over 1000μm. The novel trepanning systems have been customized for different industrial applications. This paper outlines the development steps and advanced performance, accenting laser micro machining of up to 1mm thick metal and ceramic samples and laser parameters. The results presented in this contribution emphasize differently tapered through holes with an entrance diameter of 90 to 150μm.

The LMTB has designed and implemented a novel optical concept for the development of a versatile trepanning system, enabling the adjustment of the displacement and the inclination angle during circular rotation at up to 20000 r.p.m. The presented trepanning systems are able to laser machine through-holes diameters of 100 mu m with a negative taper of up to 5 degrees. Starting from an early stage of implementation, the novel trepanning system has been customized for different applications and industrial partners. The conference paper outlines the development steps and advanced performance, accenting laser micro machining results utilizing the novel LMTB trepanning system in operation at different laser parameters.

Laser induced micro-ablation using diode-pumped short -pulsed solid-state laser systems offer the possibility to machine and structure a whole range of different materials at adequate speed and high precision. To avoid negative thermal and mechanical effects at given laser parameters that may obstruct the precision, the LMTB has designed and implemented a novel optical concept for the development of a versatile trepanning system, enabling the adjustment of beam displacement and inclination during the fast circular rotation of the optics. The presented trepanning systems are designed to laser machine through -holes with a diameter in a range of 50 to 1000 µm. The through -holes can be processed with a taper of +3°..0..-3°, including the special case of cylindrical drilling. Starting from an early stage of implementation, the novel trepanning system has been customized for different applications and industrial partners. This paper outlines the development steps and advanced performance, accenting laser micro machining results utilizing the novel LMTB trepanning system in operation at varying laser parameters, such as pulse width and wavelength.

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Positive ions and radicals in C2F6 and CHF3 high density discharges were measured using a direct-line-of-sight mass spectrometer. The ion energy distributions of the dominant ions were measured as a function of process conditions. Appearance potential mass spectrometry was performed to measure trends of the radical densities. For C2F6 plasmas CF3 and CF3+are the most abundant neutral and ionic species, respectively. CF3 is the most abundant neutral species for a CHF3 plasma, whereas CHF2+ and CF+ are the most abundant ionic species at 600–1000 and 1400 W, respectively. Erosion of the quartz coupling window is an important contaminant source for our inductively coupled plasma system. For comparison, downstream mass spectrometry was also applied using a closed ion source system since this approach is of interest for real-time monitoring and control. Endpoint detection for Si and SiO2 film etching in a CHF3 plasma was investigated using the downstream mass spectrometer system and compared with data obtained simultaneously using the direct-line-of-sight mass spectrometer and optical emission spectroscopy. It was found that the downstream mass spectrometer system can be used for endpoint detection during SiO2 over Si selective etching. The signal changes of different species measured by these techniques for different SiO2 and Si etching processes as a function of time are reported and compared.

Chemischer InformationsdienstVolume 13, Issue 12 Other Subjects ChemInform Abstract: Photoelectrochemical Performance of the n-CdSe/Aqueous Polysulfide System at Room- and Sub-Zero Ambient Temperatures. N. MUELLER, N. MUELLERSearch for more papers by this authorR. TENNE, R. TENNESearch for more papers by this authorD. CAHEN, D. CAHENSearch for more papers by this author N. MUELLER, N. MUELLERSearch for more papers by this authorR. TENNE, R. TENNESearch for more papers by this authorD. CAHEN, D. CAHENSearch for more papers by this author First published: March 23, 1982 https://doi.org/10.1002/chin.198212369Read the full textAboutPDF ToolsRequest permissionExport citationAdd to favoritesTrack citation ShareShare Give accessShare full text accessShare full-text accessPlease review our Terms and Conditions of Use and check box below to share full-text version of article.I have read and accept the Wiley Online Library Terms and Conditions of UseShareable LinkUse the link below to share a full-text version of this article with your friends and colleagues. Learn more.Copy URL Share a linkShare onFacebookTwitterLinked InRedditWechat No abstract is available for this article. Volume13, Issue12March 23, 1982 RelatedInformation

(1968). Design Data For The Liquid-Liquid Jet Pump. Journal of Hydraulic Research: Vol. 6, No. 2, pp. 129-162.