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论文（230）

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1CHARACTERIZATION OF SERVER THERMAL MASS THERMAL MANAGEMENT OF MANY-CORE PROCESSORS USING POWER MULTIPLEXING

M. David,R. Simons,D. Graybill,V. Kamath,B. Kochuparambil, R. Rainey,R. Schmidt

2019

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2Coolant and Ambient Temperature Control for Chillerless Liquid Cooled Data Centers

Timothy Chainer,Milnes P. David,Madhusudan Iyengar,Pritish R. Parida,Robert E. Simons

2017OSTI OAI (US Department of Energy Office of Scientific and Technical Information)引用：26

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3Cooling System with Automated Seasonal Freeze Protection

Levi A. Campbell,Richard C. Chu,Milnes P. David,Jr. Ellsworth,Madhusudan Iyengar,Robert E. Simons,Prabjit Singh,Jing Zhang

2016OSTI OAI (US Department of Energy Office of Scientific and Technical Information)引用：23

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4Effectiveness-weighted Control Method for a Cooling System

Levi A. Campbell,Richard C. Chu,Milnes P. David,Michael Ellsworth,Madhusudan Iyengar, Roger Schmidt,Robert E. Simons

2015OSTI OAI (US Department of Energy Office of Scientific and Technical Information)

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5FIELD-REPLACEABLE BANK OF IMMERSION-COOLED ELECTRONIC COMPONENTS AND SEPARABLE HEAT SINKS

Levi A Campbell,Richard C Chu,Milnes P David,Michael J Ellsworth,Madhusudan K Iyengar,Roger R Schmidt,Robert E Simons

2015引用：24

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6Valve controlled, node-level vapor condensation for two-phase heat sink(s)

Levi A Campbell,Richard C Chu,Milnes P David,Michael J Ellsworth,Madhusudan K Iyengar,Robert E Simons

2015引用：28

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7COOLANT-COOLED HEAT SINK CONFIGURED FOR ACCELERATING COOLANT FLOW

Levi A Campbell,Richard C Chu,Milnes P David,Michael J Ellsworth,Madhusudan K Iyengar,Roger R Schmidt,Robert E Simons

2015引用：25

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8Wicking vapor-condenser facilitating immersion-cooling of electronic component(s)

Levi A Campbell,Richard C Chu,Milnes P David,Michael J Ellsworth,Madhusudan K Iyengar,Robert E Simons

2015引用：24

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9LIQUID-COOLING APPARATUS WITH INTEGRATED COOLANT FILTER

Levi A Campbell,Richard C Chu,Milnes P David,Michael J Ellsworth,Madhusudan K Iyengar,Roger R Schmidt,Robert E Simons

2015引用：22

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10Immersion-cooling of selected electronic component(s) mounted to printed circuit board

Levi A Campbell,Richard C Chu,Milnes P David,Michael J Ellsworth,Madhusudan K Iyengar,Roger R Schmidt,Robert E Simons

2015引用：25

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11FIELD-REPLACEABLE BANK OF IMMERSION-COOLED ELECTRONIC COMPONENTS

Levi A Campbell,Richard C Chu,Milnes P David,Michael J Ellsworth,Madhusudan K Iyengar,Roger R Schmidt,Robert E Simons

2015引用：24

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12PUMP-ENHANCED, IMMERSION-COOLING OF ELECTRONIC COMPONENT(S)

Levi A Campbell,Richard C Chu,Milnes P David,Michael J Ellsworth,Madhusudan K Iyengar,Roger R Schmidt,Robert E Simons

2015引用：23

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13Air-cooling and vapor-condensing door assembly

Levi A Campbell,Richard C Chu,Milnes P David,Michael J Ellsworth,Madhusudan K Iyengar,Roger R Schmidt,Robert E Simons

2015引用：24

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14DIRECT COOLANT CONTACT VAPOR CONDENSING

Levi A Campbell,Richard C Chu,Milnes P David,Dustin W Demetriou,Michael J Ellsworth,Madhusudan K Iyengar,Roger R Schmidt,Robert E Simons

2015引用：23

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15Immersion-cooled and conduction-cooled electronic system

Levi A Campbell,Richard C Chu,Milnes P David,Michael J Ellsworth,Madhusudan K Iyengar,Roger R Schmidt,Robert E Simons

2015引用：26

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16Sectioned manifolds facilitating pumped immersion-cooling of electronic components

Levi A Campbell,Richard C Chu,Milnes P David,Michael J Ellsworth,Madhusudan K Iyengar,Roger R Schmidt,Robert E Simons

2015引用：25

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17VAPOR CONDENSER WITH THREE-DIMENSIONAL FOLDED STRUCTURE

Levi A Campbell,Richard C Chu,Milnes P David,Michael J Ellsworth,Madhusudan K Iyengar,Roger R Schmidt,Robert E Simons

2014引用：24

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18Inlet-air-cooling door assembly for an electronics rack

Levi A Campbell,Richard C Chu,Milnes P David,Michael J Ellsworth,Roger R Schmidt,Robert E Simons, Daniel E Zambrano

2014引用：23

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19EFFECTIVENESS-WEIGHTED CONTROL OF COOLING SYSTEM COMPONENTS

Levi A Campbell,Richard C Chu,Milnes P David,Michael J Ellsworth,Madhusudan K Iyengar,Roger R Schmidt,Robert E Simons

2014引用：24

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20Heat sink structure with a vapor-permeable membrane for two-phase cooling

Levi A Campbell,Richard C Chu,Milnes P David,Michael J Ellsworth,Madhusudan K Iyengar,Robert E Simons

2014引用：31

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作者统计

合作学者

合作机构

D-Core

合作者
学生
导师

Richard C Chu合作论文数211

Michael J Ellsworth合作论文数192

Madhusudan K. Iyengar合作论文数ibm149

Campbell, L.合作论文数147

Roger R Schmidt合作论文数89

Milnes P David合作论文数STG Adv. Thermal Energy Efficiency Lab., Int. Bus. Machines Corp.;c;STG Adv. Thermal Energy Efficiency Lab., Int. Bus. Machines Corp.54

Gregory M. Chrysler合作论文数11

david t vader合作论文数7

Prabjit Singh合作论文数7

Timothy J Chainer合作论文数7

Mark D. Schultz合作论文数6

Vinod Kamath合作论文数6

Michael a Gaynes合作论文数6

Gary F Goth合作论文数6

Pritish R. Parida合作论文数TJ Watson Res Ctr, IBM6

Dereje Agonafer合作论文数Department of Mechanical and Aerospace Engineering, University of Texas at Arlington5

timothy m anderson合作论文数4

bejoy j kochuparambil合作论文数4

david p graybill合作论文数3

Zoodsma, R.合作论文数3

Evan G Colgan合作论文数Thomas J. Watson Research Center3

gregory m chrysler合作论文数2

michael l zumbrunnen合作论文数2

dayuan shih合作论文数2

randall g kemink合作论文数2

Donald W. Porter合作论文数2

edward furey合作论文数2

bruce k furman合作论文数2

Paul Lauro合作论文数2

omkarnath r gupta合作论文数1

Manno, V.P.合作论文数1

eric j mckeever合作论文数1

unpah hwang合作论文数1

takeshi tsukamoto合作论文数1

maurice f holahan合作论文数1

jody a hickey合作论文数1

jason aaron matteson合作论文数1

edward j seminaro合作论文数1

martin joseph crippen合作论文数1

J. Wilson合作论文数1

lasance clemens j m合作论文数1

micheal j ellsworth合作论文数1

michael rizzolo合作论文数IBM Res, 257 Fuller Rd, Albany, NY 12203 USA1

jing zhang合作论文数1

Wagner, R.合作论文数1

Lian-Tuu Yeh合作论文数1

V. W. Antonetti合作论文数1

Dustin W Demetriou合作论文数1

Sevgin Oktay合作论文数1

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