We demonstrate the utility of nonplanar building blocks to tune the polymer photoelastic birefringence and obtain near zero and negative photoelastic coefficients. Photoelastic properties of two novel random copolymers systems: 2-vinlypyridene (2VP)-hydroxyadmantyl methacrylate (HAMA) and vinyl pyrrollidone (VP)-isobornylacrylate (iBOA) were investigated at a function of comonomer composition. Photoelastic coefficient of the copolymers could be facilely tuned by changing the copolymer composition. In particular, we show that negative stress optic coefficient could be obtained from VP - iBOA copolymers and near zero stress optic coefficient could be obtained from 2VP-HAMA copolymers. In addition, we investigate the effect of addition of triethylene glycol (TEG) as a plasticizer on the photoelastic properties for the 2VP-HAMA copolymers. We found that addition of TEG led to a reduction in both the polymer T-g and photoelastic coefficient. Our study indicates that bulky non-planar side groups in the polymer backbone tend to induce negative photoelastic birefringence and can be utilized as important building blocks for the design of optical polymers.

Directed self-assembly (DSA) of block copolymers (BCPs) is a promising technology for advanced patterning at future technology nodes, but significant hurdles remain for commercial implementation. While chemoepitaxy processes employing poly(styrene-block-methyl methacrylate) (PS-PMMA) are most widely studied for DSA line/space patterning, graphoepitaxy processes using more strongly segregated "high-chi" block copolymers have recently shown a lot of promise, with lower defectivity and line-width roughness (LWR) than comparative chemoepitaxy processes. This paper reports on some of the design considerations for optimizing line/space patterning with these materials. We have found that brush and block copolymer selection are critical to achieve high quality DSA. For example, brush thickness must be optimized to achieve matching space critical dimensions, and brush surface energy impacts kinetics of assembly. The chi parameter of the block copolymer should be optimized to balance LWR, kinetics of assembly, and process window. Glass transition temperature (T-g) of the blocks showed little impact on performance. Overall, parameters of both BCP and brush must be simultaneously optimized to achieve high quality DSA.

Block co-polymer directed self-assembly (BCP DSA) has become an area of fervent research activity as a potential alternative or adjunct to EUV lithography or self-aligned pitch multiplication strategies. This presentation will evaluate two DSA strategies for patterning line-space arrays at 30nm pitch: graphoepitaxial DSA with surface-parallel cylinder BCPs and chemoepitaxial DSA with surface-normal lamellar BCPs. A comparison of pattern transfer into hard-mask and substrate films will be made by consideration of line and space CDs, line profile of cross-sectional SEM images, and comparison of relative LWR/SWR. The processes will be benchmarked against Micron's process used in manufacturing its 16nm half-pitch NAND part.

In this study, we used scanning tunneling microscopy (STM) and density functional theory (DFT) to examine the bonding structure of CH3N adsorbed on the Cu(110) surface. A previous study [Chin. J. Phys. 2005, 43, 212-218] shows the adsorbed CH3N aggregate to form. a zigzag structure with a p(2 x 3) unit cell, without considering the possibility of adsorbate-induced surface reconstruction. Here, we propose a revised adsorption structure, with the key feature of bonding each CH3N with two Cu adatoms in a tetrahedral manner. Three structure models (double-row, dimer, and alternative-dimer) are examined by ab initio calculations. We find that the most energetically favorable model is the double-row model with CH3N bonding alternatingly along either side of double added rows from Cu adatoms.

Directed self-assembly (DSA) of block copolymers (BCPs) is a promising technology for advanced patterning at future technology nodes, but significant hurdles remain for commercial implementation. The most widely studied material for DSA is poly(styrene-block-methyl methacrylate) (PS-PMMA), but the relatively weak segregation strength of PS-PMMA results in some limitations. This paper reports on these limitations for PS-PMMA and highlights a path to success through use of more strongly segregated "high-chi" block copolymers. In general, stronger segregation is predicted to lower defectivity at equilibrium, but unfortunately, kinetics of self assembly also becomes much slower as segregation strength increases. Recognizing diffusion is much faster for cylinder morphologies than lamellar ones, we have investigated new cylinder-forming BCPs that enable defect elimination with thermal annealing processes. In addition, a formulation strategy is presented that further improves the kinetics of the assembly process, enabling tremendous improvements in defectivity over simple BCP systems. Excitingly, successful chemoepitaxy DSA with a high-chi lamellar BCP is also demonstrated using a thermal annealing process and no top coat. These technologies hold promise to enable DSA with thermal annealing processing across pitches from 40 - 16 nm.

Directed self- assembly (DSA) of block copolymers (BCPs) is a promising technology for advanced patterning at future technology nodes, but significant hurdles remain for commercial implementation. The most widely studied material for DSA is poly(styrene-block-methyl methacrylate) (PS-PMMA), but the relatively weak segregation strength of PS-PMMA results in some limitations. This paper reports on these limitations for PS-PMMA and highlights a path to success through use of more strongly segregated "high-chi" block copolymers. In general, stronger segregation is predicted to lower defectivity at equilibrium, but unfortunately, kinetics of self assembly also becomes much slower as segregation strength increases. Recognizing diffusion is much faster for cylinder morphologies than lamellar ones, we have investigated new cylinder-forming BCPs that enable defect elimination with thermal annealing processes. In addition, a formulation strategy is presented that further improves the kinetics of the assembly process, enabling tremendous improvements in defectivity over simple BCP systems. Excitingly, successful chemoepitaxy DSA with a high-chi lamellar BCP is also demonstrated using a thermal annealing process and no top coat. These technologies hold promise to enable DSA with thermal annealing processing across pitches from 40 - 16 nm.

Directed self-assembly (DSA) of block copolymers (BCPs) is a promising technology for advanced patterning at future technology nodes, but significant hurdles remain for commercial implementation. The most widely studied material for DSA is poly(styrene-block-methyl methacrylate) (PS-PMMA), but this material has a relatively weak segregation strength that has limited its utility to patterns above 24 nm pitch. This paper reports on some of Dow's efforts to develop new materials capable of extending DSA to smaller pitch by development of new BCP copolymer materials with stronger segregation strength. Some preliminary efforts are reported on new substrate treatments that stabilize perpendicular orientations in a high-χ block copolymer that also incorporate an etch-resistant block to facilitate patterning at small dimensions. In addition, development of new block copolymer materials that have a χ-parameter that is large enough to drive defect reduction and but not so high that it precludes thermal annealing are also presented. DSA of these new materials is demonstrated using thermal annealing processes at pitch ranging from 40 to 16 nm, and etch capability is also demonstrated on a material with 18 nm pitch. These technologies hold promise for the extension of DSA to sub 24 nm pitch.

In this paper, we consider the problems of peer-to-peer media streaming in highly dynamic environments, including the peer selection and the aggregation of available bandwidth. To select reliable peers, we propose an adaptive peer selection algorithm based on the consideration of uplink bandwidth, life time, playback fault times, and the number of candidates for live broadcasting. In addition, the uplink bandwidth from one single sender cannot supply a streaming request alone so a receiver should download segments from cooperative senders. To aggregate the available bandwidth of multiple senders for streaming, we design a media segments assignment algorithm to resolve this problem. In the proposed media streaming scheme, the time delay of playback and the probability that playback faults happen are analyzed to evaluate the system performance. The simulation results show that our solution is reliable and robust for media streaming. Especially, if the peers join/leave the system frequently during media streaming, the benefits of the proposed schemes are obvious to receivers.

We report the fabrication of silicon nanopillar-based nanocapacitor arrays using metal-assisted etching in conjunction with electrodeposition. The high aspect ratio made possible by the catalyzed etching provides for an increased effective electrode area and hence a significant improvement in the capacitance density. Electroplated Ni electrode forms a conformal layer over the silicon nanopillars. Capacitance measurements show the expected trend as a function of pillar height and array period. The fabrication approach is simple, compatible with integration into standard silicon technology, and easily scalable.