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william e wilson | AMiner学者主页 | AMiner

william e wilson

18Papers / 论文

624Citations / 引用

18H-Index

浏览量7

全面呈现 [william e wilson] 的学术影响力

深度挖掘高质量成果与权威引用，让优秀看得见

论文（18）

专利

基金项目

按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选

1Apparatus for making circuitized substrates in a continuous manner

John M Lauffer,Voya R Markovich,James W Orband,William E Wilson

2007引用：23

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2Method of making a circuitized substrate

Robert M Japp,Voya R Markovich,John M Lauffer,William E Wilson

2007引用：23

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3Apparatus and method for making circuitized substrates in a continuous manner

John M Lauffer,Voya R Markovich,James W Orband,William E Wilson

2007引用：33

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4Method of forming printed circuit card

Kenneth Fallon,Miguel A Jimarez,Ross W Keesler,John M Lauffer,Roy H Magnuson,Voya R Markovich,Irving Memis,Jim P Paoletti,Marybeth Perrino,John A Welsh,William E Wilson

2006引用：29

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5Colloidal seed formation for printed circuit board metallization

Raymond T Galasco,Roy H Magnuson,Voya R Markovich,Thomas R Miller, Anita Sargent,William E Wilson

2005引用：22

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6Process of fabricating a circuitized structure

Gerald Walter Jones,Ross W Keesler,Voya R Markovich,William John Rudik,James Warren Wilson,William E Wilson

2004引用：28

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7Two signal one power plane circuit board

Kenneth Fallon,Miguel A Jimarez,Ross W Keesler,John M Lauffer,Roy H Magnuson,Voya R Markovich,Irv Memis,Jim P Paoletti,Marybeth Perrino,John A Welsh,William E Wilson

2004引用：88

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8Forming a through hole in a photoimageable dielectric structure

Stephen J Fuerniss,Joan Cangelosi,Gary Johansson,Ross W Keesler,John M Lauffer,Voya R Markovich,Peter A Moschak,David J Russell,William E Wilson

2003引用：23

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9Through hole in a photoimageable dielectric structure with wired and uncured dielectric

Administrator Deceasedby Joan Cangelosi Stephen J Fuerniss,Gary Johansson,Ross W Keesler,John M Lauffer,Voya R Markovich,Peter A Moschak,David J Russell,William E Wilson

2003引用：39

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10Composite laminate circuit structure and methods of interconnecting the same

John M Lauffer,Voya R Markovich,Thomas R Miller,Konstantinos I Papathomas,William E Wilson

2002引用：51

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11Full additive process with filled plated through holes

Anilkumar C Bhatt,Voya R Markovich,Irving Memis,William E Wilson

2001引用：65

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12Integrated manufacturing packaging process

Gerald Walter Jones,Ross W Keesler,Voya R Markovich,William John Rudik,James Warren Wilson,William E Wilson

2000引用：23

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13Electronic device packages having glass free non conductive layers

Bernd K Appelt,Anilkumar Chinuprasad Bhatt,James W Fuller,John M Lauffer,Voya R Markovich, William J Rudik,William E Wilson

1999引用：38

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14Printed circuit boards for electronic device packages having glass free non-conductive layers and method of forming same

Bernd K Appelt,Anilkumar Chinuprasad Bhatt,James W Fuller,John M Lauffer,Voya R Markovich,William John Rudik,William E Wilson

1999引用：28

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15Composite laminate circuit structure and method of forming the same

Ross W Keesler,Voya R Markovich,Jim P Paoletti,Marybeth Perrino,William E Wilson

1998引用：23

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16Filling open through holes in a multilayer board

John M Lauffer,Voya R Markovich,Cheryl Palomaki,William E Wilson

1998引用：40

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17Process for tenting PTH's with PID dry film

Gerald Walter Jones,Ross W Keesler,Voya R Markovich, Heinke Marcello,James Warren Wilson,William E Wilson

1997引用：25

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18Semi-subtractive circuitization

Roy H Magnuson,Richard William Malek,Voya R Markovich,William E Wilson

1995引用：23

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作者统计

合作学者

合作机构

D-Core

合作者
学生
导师

Voya R. Markovich

Voya R. Markovich合作论文数18

John M. Lauffer

John M. Lauffer合作论文数11

ross w keesler

ross w keesler合作论文数8

roy h magnuson

roy h magnuson合作论文数4

william john rudik

william john rudik合作论文数3

jim p paoletti

jim p paoletti合作论文数3

marybeth perrino

marybeth perrino合作论文数3

gerald walter jones

gerald walter jones合作论文数3

irving memis

irving memis合作论文数2

anilkumar chinuprasad bhatt

anilkumar chinuprasad bhatt合作论文数2

james w fuller

james w fuller合作论文数2

miguel a jimarez

miguel a jimarez合作论文数2

john a welsh

john a welsh合作论文数2

david j russell

david j russell合作论文数2

gary johansson

gary johansson合作论文数2

peter a moschak

peter a moschak合作论文数2

james w orband

james w orband合作论文数2

kenneth fallon

kenneth fallon合作论文数2

Thomas Miller

Thomas Miller合作论文数Magic Leap Inc2

Bernd K. Appelt

Bernd K. Appelt合作论文数ASE Grp, 1255 E Arques Ave, Sunnyvale, CA 94085 USA2

richard william malek

richard william malek合作论文数1

cheryl palomaki

cheryl palomaki合作论文数1

robert m japp

robert m japp合作论文数1

anilkumar c bhatt

anilkumar c bhatt合作论文数1

raymond t galasco

raymond t galasco合作论文数1

konstantinos i papathomas

konstantinos i papathomas合作论文数1

joan cangelosi

joan cangelosi合作论文数1

Stephen J. Fuerniss

Stephen J. Fuerniss合作论文数1

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