为满足拼接式超大面阵型红外探测器的空间应用需求,超大规模冷平台组件需要在低温下工作,冷平台支撑结构需要较高的刚度以满足组件的抗振动性能,又需要较高的结构热阻以降低其传导漏热.提出了对称式八杆结构作为冷平台支撑,该支撑结构采用新型的高强度、低热导率的氧化锆陶瓷材料.基于有限元软件分析了支撑结构的高度、安装倾斜角度、宽厚比和材料对于组件的模态基频、支撑结构热阻以及组件在 30g静力学载荷下的最大应力的影响,通过对比选取了其中一组参数设计了实际的测试组件,支撑的结构热阻达到了 220 K/W,对组件进行了 5～2 000 Hz的正弦扫频试验、总均方根为 9g RMS的XYZ三个方向的随机振动等力学环境试验,最终组件通过了空间环境适应性试验验证,组件的基频达到了 560 Hz,并且测试结果与仿真结果趋势符合较好.结果表明:对称式八杆氧化锆支撑结构解决了超大面阵型红外探测器冷平台组件既需要高力学性能又需要低漏热的难题,满足工程化应用需求.

针对微型红外探测器组件的应用特点,介绍了国内外微型红外探测器组件集成技术的发展现状,重点阐述了红外探测器组件集成中的几种关键技术.这些技术的研究和发展对于推进微型红外探测器组件的应用至关重要.

Aiming at the requirement of fast cooling,low power consumption and environmental adaptability of 15μm 320 * 256 very long wavelength QWIP,the characteristics of low temperature integrated assembly of the 15μm QWIP were analyzed.Basedh on the cryogenic integration technology of coldfinger design,thermal design of the cold shield and cold platform auxiliary support structure design,so as,to achieve rapid cooling,low power consumption and high environmental adaptability of QWIP integrated assembly.After testing,the QWIP packaged with IDCA meets the requirements of the project.

Compared with a cooled infrared detector,an uncooled infrared detector has the advangtages of small size,low weight and low power consumption because it has not any cooler.To improve the encapsulation process of an uncooled infrared detector after exhaustion and achieve its configuration optimization and reliability enhancement,a technical scheme to use laser welding to encapsulate the uncooled infrared detector in high vacuum is proposed.The test result shows that the uncooled infrared detector assembly has not apparent variation in performance and can meet the requirements for actual application.

Highly hermetical laser sealing is a packaging technology which can be used for metal packages.It can achieve the sealing of a small hole of the metal package containing an infrared detector in a high vacuum environment.Thus,both the exhaust process and the sealing process of the infrared detector assembly can be finished at the same time.According to the structure and material of a micro package,the relation of the current and pulse width of a laser welding equipment to welding energy and the influence of the current,pulse width and defocusing distance on welding quality are analyzed.Proper laser welding parameters are obtained for Kovar materials.With those parameters,the laser sealing of a hole of the metal package containing an infrared detector is achieved.The test result shows that its leak rate is better than 1×10~(_10)Torr·1/s.

In this paper,the ultraviolet (UV) processing technology is mainly presented.The materials processed by both UV and infrared (IR) laser equipment are compared with each other in experiment. The experimental results show that the UV laser is better than the YAG laser in processing quality and efficiency.Especially,the UV laser is obviously superior in the fine processing of the material for IR devices with high transmittance.