An arsenic atom displacement in As+ ion implanted Si induced by He+ ion beam irradiation has been studied by medium-energy (175keV) ion spectroscopy (MEIS). The He+ energy and dose dependences of the displaced arsenic atoms have been examined in the range of 30–175keV and ≤6×10−4C/cm2, respectively. The amount of the displaced arsenic atoms are found to be proportional to the dose and inversely proportional to the nuclear stopping power in the low-dose region, while it saturates at high-dose region. The dose-proportional region is composed of two different proportional coefficient segments.

This paper discusses the temperature dependence of recombination lifetime in a variety of silicon materials using energy level as a parameter. A theoretical approach based on the Shockley-Read-Hall theory for energy level calculations has been used. Various types of defects created by introducing impurities, dislocations and grain boundaries into silicon waferswere studied. Results are presented for Czochralski grown Si wafers intentionally contaminated with gold and chromium, EFG ribbon with varying concentration of oxygen, web ribbons with extended defects and contaminants, large grain polycrystalline material, and Si/Si-Ge/Si heterostructures with varying misfit and threading dislocation density.