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论文共 70 篇作者统计合作学者相似作者
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2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-4, (2024)
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.157-163, (2024)
V. Thukral,R. Roucou, C. Chou,J.J.M. Zaal,M. van Soestbergen,R.T.H. Rongen, W.D. van Driel, G.Q. Zhang
Microelectronics reliability/Microelectronics and reliability (2024): 115430-115430
MICROELECTRONICS RELIABILITY (2024)
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (2024)
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-6, (2024)
Varun Thukral, Irene Bacquet,Michiel van Soestbergen,Jeroen Zaal,Romuald Roucou,Rene Rongen,Willem D. van Driel, GuoQi Zhang
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.806-813, (2023)
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (2023)
2023 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, IRPS (2023)
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作者统计
#Papers: 70
#Citation: 1238
H-Index: 17
G-Index: 34
Sociability: 5
Diversity: 2
Activity: 16
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