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Aditya Kumar (M'09) received the Ph.D. degree in materials science and engineering from Nanyang Technological University (NTU), Singapore.
He is currently working as a Senior Engineer in the Technology Development and Research Department, Globalfoundries, Singapore. Before joining Globalfoundries, he worked as a Senior Research Engineer in the Microsystems, Modules and Components Laboratory, Institute of Microelectronics, Singapore, and as a Research Associate in the School of Materials Science and Engineering, NTU. He has more than 30 journal and conference publications and one U.S. patent to his credit. His current research interests include thin film processing and characterization, electronic device and packaging materials, 3-D-packaging, wafer-level embedded packages, and reliability and failure analysis.
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论文共 167 篇作者统计合作学者相似作者
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Carsten Warneke,Joshua P. Schwarz,Jack Dibb,Olga Kalashnikova,Gregory Frost, Jassim Al-Saad,Steven S. Brown, Wm Alan Brewer,Amber Soja,Felix C. Seidel,Rebecca A. Washenfelder,Elizabeth B. Wiggins,
JOURNAL OF GEOPHYSICAL RESEARCH-ATMOSPHERESno. 2 (2023)
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