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Harshpreet Singh Bakshi (Senior Member, IEEE) received the B.Tech. degree in electronics and telecommunication engineering from Bharati Vidyapeeth University, Pune, India, in 2015, and the M.S. and Ph.D. degrees in electrical engineering from The University of Texas at Dallas, Richardson, TX, USA, in 2018 and 2022, respectively.
Between 2015 and 2022, he worked with Idea Cellular, Ltd., CommScope, Inc., Apple Inc., and Texas Analog Center of Excellence. He is currently with the Semiconductor Packaging Platform Technology's R&D Organization, Texas Instruments, Inc., Dallas, TX, USA. His research interests include mmWave and THz passive component design, semiconductor packaging, and RF system design.
Dr. Bakshi serves as a Reviewer of several journals and conferences for the IEEE AP-S, MTT-S, and EP-S, and has held leadership positions with the IEEE EP-S Dallas and SSC-S UTD chapters.
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论文共 3 篇作者统计合作学者相似作者
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IEEE TRANSACTIONS ON TERAHERTZ SCIENCE AND TECHNOLOGYno. 2 (2024): 216-227
Oscar F. Medina,Aditya N. Jogalekar, Kannan Nambiar, Devan Iyer,Andrew Blanchard, Hongbing Lu, Rashaunda Henderson
2024 IEEE/MTT-S International Microwave Symposium - IMS 2024pp.410-413, (2024)
arxiv(2019)
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#Papers: 3
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