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个人简介
Siqi Bai (Student Member, IEEE) received the B.S. degree in optoelectronic information engineering from the Huazhong University of Science and Technology, Wuhan, China, in 2015, and the M.S. degree in electrical engineering in 2018 from the Missouri University of Science and Technology (Missouri S&T), Rolla, MO, USA, where he is currently working toward the Ph.D. degree in electrical engineering with the Electromagnetic Compatibility (EMC) Laboratory.
His research interests include PDN modeling and design, signal integrity, and automotive electromagnetic interference (EMI).
Mr. Bai was a recipient of the 2020 Designcon best paper award and a recipient of the 2020 IEEE International Symposium on EMC best student paper award.
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2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)pp.688-692, (2023)
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IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITYno. 5 (2023): 1548-1555
Yuanzhuo Liu,Siqi Bai,Chaofeng Li, Vanine Sabino De Moura,Bichen Chen,Srinivas Venkataraman,Xu Wang,DongHyun Kim
IEEE Transactions on Signal and Power Integrity (2023): 94-102
IEEE Transactions on Signal and Power Integrity (2022): 1-9
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