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个人简介
Richard Eddins (Member, IEEE) received the degree from the Alabama Aviation and Technical College, Ozark, AL, USA, and is continuing education coursework with Troy State University, Troy, AL, USA, and others.
He is currently a Staff Engineer within GE Aviation’s Advanced Technologies Organization, Evendale, OH, USA. He is also leading the development of numerous wide bandgap (WBG) modules and products at the Conversion and Control Business Unit, Pompano Beach, FL, USA. In cooperation with the GE’s Global Research Center, Niskayuna, NY, USA, he has led developments of advanced silicon carbide (SiC) and GaN power modules for more than 12 years, with focus areas including high temperature operation and reliability testing. He has led teams to insert SiC power modules into the earliest SiC enabled power conversion equipment delivered to the DoD, which supported various directed energy and hybrid vehicle applications. He holds patents in the WBG area, including US10381833B2 for Solid State Power Contactor, in addition to numerous others related to high power density, low inductance, and wire bond free packaging. Prior to the WBG developments at GE, he spent 25 years designing high frequency power conversion products for defense applications, including airborne and ground vehicles platforms. He also supports various industry efforts to promote wide band gap device adoption and advanced packaging solutions.
研究兴趣
论文共 3 篇作者统计合作学者相似作者
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IEEE journal of emerging and selected topics in power electronicsno. 2 (2023): 1865-1878
2021 IEEE ENERGY CONVERSION CONGRESS AND EXPOSITION (ECCE)pp.1514-1520, (2021)
作者统计
#Papers: 3
#Citation: 47
H-Index: 3
G-Index: 3
Sociability: 2
Diversity: 1
Activity: 2
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