基本信息
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Career Trajectory
Bio
Hsing-Ning Liu received the M.S. degree in mechanical engineering from Chun Yuan Christian University, Taoyuan, Taiwan, in 2015.
Since 2016, he has been with Unimicron Technology Corporation, Taoyuan, where he is currently a Senior Engineer with the Electronic Design Automation Division, CSO office.
Research Interests
Papers共 15 篇Author StatisticsCo-AuthorSimilar Experts
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2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.542-547, (2023)
John H. Lau,Curry Lin,Hsing-Ning Liu,Kai-Ming Yang,Tim Xia,Cheng-Ta Ko,Bruce Puru Lin, Yu-Ling Chuang,R. Chen, M. Ma,Tzyy-Jang Tseng,Ming Li,K. Leung
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 9 (2023): 1371-1379
Channing Cheng-Lin Yang,John H. Lau,Gary Chang-Fu Chen, Joe Huang, Andy Peng,Hsing-Ning Liu,Y-H. Chen,Tzyy-Jang Tseng
IMAPS symposia and conferencesno. Issue 1 (2023)
Journal of microelectronics and electronic packagingno. 1 (2022): 8-17
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)pp.30-37, (2022)
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 3 (2022): 469-478
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)pp.148-156, (2021)
IEEE transactions on components, packaging, and manufacturing technologyno. 8 (2021): 1301-1309
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)pp.885-894, (2021)
John H. Lau, Cheng-Ta Ko,Chia-Yu Peng,Kai-Ming Yang,Tim Xia,Puru Bruce Lin, Jean-Jou Chen,Po-Chun Huang,Tzvy-Jang Tseng,Eagle Lin,Leo Chang,Curry Lin,Yan-Jun Fan,Hsing-Ning Liu, Winnie Lu
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)pp.359-364, (2021)
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Author Statistics
#Papers: 15
#Citation: 55
H-Index: 6
G-Index: 7
Sociability: 3
Diversity: 0
Activity: 0
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