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排名必读论文期刊顶会热点AI 简史溯源树小脉星探人才迁徙塔尖人才国防情报追踪开源工具智慧手语
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论文共 320 篇作者统计合作学者相似作者

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CoolStar: A New Approach to Automotive HPC Cooling with Improved Thermo-Mechanical Design
Baris Erol,Daniel May,Bernhard Wunderle
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-10, (2024)
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Multi-purpose Thermal Test Vehicle for Experimental Investigation on Pumped Two-Phase Cooling
Ralph Schacht, Ben Majed, Tobias Gruen,Daniel May,Bernhard Wunderle
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-7, (2024)
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Reduced-Order Model for Solder Balls – Potential of projection-based approaches for representing viscoplastic behavior
Mike Feuchter, Hanna Baumgartl, Martin Hanke,Sven Rzepka,Bernhard Wunderle
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-8, (2024)
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Fatigue behavior of aluminum and copper metallization for SiC during APC
Daniel Losbichler,Markus Klingler, Steffen Orso,Bernhard Wunderle
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-8, (2024)
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Enhancing Defect Detection Using Lock In Thermography
Doaa Mohamed,Daniel May,Kaushal Arun Pareek, Mohamad Abo Ras,Bernhard Wunderle
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-9, (2024)
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Finite Element Simulation of Accelerated Stress Testing and Damage Detection for Micro and Nano Structures Using Surface Acoustic Waves (SAWs)
Arash Mohammadi, George Boldeiu, Dan Vasilache,Afshin Ziaei,Bernhard Wunderle
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-9, (2024)
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Design and Simulation of a High Cycle Fatigue Vibration Tester for Accelerated Stress Testing of Thin Films and Bimaterial interfaces
David Walther, Arash Mohammadi, Jörg Arnold,Bernhard Wunderle
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-8, (2024)
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Failure Analysis of Sintered Layers in Power Modules Using Laser Lock-in Thermography
S. Panahandeh, D. May, C. Grosse-Kockert,B. Wunderle,M. Abo Ras
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-7, (2023)
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MEMS Cantilever on High-Cycle Fatigue Testing of thin Metal Films
N. Jöhrmann, C. Stöckel,B. Wunderle
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-6, (2023)
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Modelling Creep Behaviour in Sintered Silver using User-Programmable Features in ANSYS
Freerik Forndran,Jens Heilmann,Martin Metzler, Markus Leicht,Bernhard Wunderle
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-9, (2023)
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