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个人简介
Cheng-Hsuan Wu received the B.S. degree in electrical engineering from National Tsing Hua University, Hsinchu, Taiwan, in 2017, and the M.S. degree in electronic engineering from The University of Tokyo, Japan, in 2020. In 2020, he joined the Research and Development Division, TSMC, Hsinchu, where he worked in the field of SRAM IP design. In 2021, he joined the IP Division of Novatek, Hsinchu, where he is currently working in the field of analog front-end (AFE) circuit design of high-speed interface IPs.
研究兴趣
论文共 3 篇作者统计合作学者相似作者
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IEEE access (2023): 74364-74378
2021 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD)pp.55-58, (2021)
2021 IEEE ENERGY CONVERSION CONGRESS AND EXPOSITION (ECCE)pp.5412-5416, (2021)
作者统计
#Papers: 3
#Citation: 13
H-Index: 2
G-Index: 2
Sociability: 2
Diversity: 0
Activity: 0
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