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个人简介
Daniel F. Baldwin received the S.M. and Ph.D. degrees in mechanical engineering from the Massachusetts Institute of Technology (MIT), Cambridge, in 1990 and 1994, respectively.
He is a Founder and President of Engent, Inc.—Enabling Next Generation Technologies, Norcross, GA, providing manufacturing services and process technologies in the areas of microelectronics, flip-chip, optoelectronics, and microelectromechanical systems (MEMS). He is an Adjunct Associate Professor of mechanical engineering with the Georgia Institute of Technology (Georgia Tech), Atlanta. He was an Associate and Assistant Professor of mechanical engineering with Georgia Tech from 1995 to 2005. Prior to joining the faculty, he was a Technical Staff Member with Bell Laboratories, Princeton, NJ, working on electronic product miniaturization. He was formerly the Vice President of Siemens' Advanced Assembly Technology Division. He was a Research Manager and Research Assistant with MIT's Laboratory for Manufacturing and Productivity from 1990 to 1994, a Draper Fellow with the Charles Stark Draper Laboratory, Cambridge, from 1988 to 1990, and an Engineering Intern with Mitsubishi Electric, Kamakura, Japan, in 1987. He has 14 years of experience in the electronics manufacturing and packaging industries. He holds seven U.S. patents, has published over 200 scholarly publications, and has expertise in electronics packaging, MEMS packaging, advanced materials processing, and manufacturing systems designs.
Dr. Baldwin is on the Board of Directors for the Surface Mount Technology Association, serving as Treasurer, and formerly was on the Board of Advisors for the Society of Manufacturing Engineers and Electronics Manufacturing Division. He is on the Editorial Advisory Board of Advanced Packaging Magazine. He is on the Board of Directors of Engent, Inc., and was on the Technical Board of Advisors of RFIDentics Corp., recently purchased by Avery Dennison Corp.
研究兴趣
论文共 83 篇作者统计合作学者相似作者
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Microelectronics Reliability (2016): 224
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semanticscholar(2016)
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Additional conferences (Device packaging, HiTEC, HiTEN, & CICMT)no. DPC (2016): 002018-002053
S Bhattacharya,Fei Xie,Han Wu,Kelley Hodge,Keck Pathammavong,Paul N Houston,Daniel F Baldwin, Albert Giorgini
International Symposium on Microelectronicsno. 1 (2015): 000627-000632
Sivasubramanian Thirugnanasambandam,Jiawei Zhang,John L Evans,Fei Xie, Matt Perry,Brian G Lewis,Daniel F Baldwin, Kent Stahn, Michel Roy
Additional conferences (Device packaging, HiTEC, HiTEN, & CICMT)no. DPC (2012): 001841-001869
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作者统计
#Papers: 83
#Citation: 2401
H-Index: 22
G-Index: 48
Sociability: 5
Diversity: 2
Activity: 0
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