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个人简介
David C. Woodrum received the B.S. and M.S. degrees in mechanical engineering from the Georgia Institute of Technology, Atlanta, GA, USA, in 2011 and 2012, respectively, where he is currently pursuing the Ph.D. degree in mechanical engineering under the supervision of Dr. S. Sitaraman.
His current research interests include mechanical reliability of two-phase on-chip microelectronics cooling, specializing in finite-element modeling.
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 9 (2017): 1465-1475
Electronic Components and Technology Conferencepp.2283-2287, (2015)
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