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Dongjin Kim (Student Member, IEEE) received the D.Eng. degree from the Department of Adaptive Machine Systems, Osaka University, Suita, Japan, in 2020.
He was a specially appointed Researcher with the Institute of Scientific and Industrial Research, Osaka University, from 2017 to 2018. He was involved in Pb/Pb-free soldering, Ag sinter joining, power electronic substrates, thermal characteristic standardization, and multiphysics finite-element simulations for long-term reliability of power electronic applications. He is currently part of the thermal management team for the Production Engineering Research Institute, LG Electronics, Inc., Pyeongtaek, South Korea. His current research interests include lead-free soldering, heat sink design, the simulation of power electronics, metallization technology, and thermal design as well as the simulation of power electronics for high reliability.
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论文共 54 篇作者统计合作学者相似作者
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2024 International Conference on Electronics Packaging (ICEP)pp.149-150, (2024)
CORROSION SCIENCE (2024): 111614-111614
2024 International Conference on Electronics Packaging (ICEP)pp.147-148, (2024)
Seoah Kim, YehRi Kim, Eunjin Jo, Hyeon-Sung Lee,Sungwook Mhin,Tae-Young Lee,Sehoon Yoo,Yong-Ho Ko,Dongjin Kim
Journal of Materials Research and Technology (2024)
Materials Science and Engineering: App.146089, (2024)
Seungyeop Baek,Junyeong Kim, Taeyang Kwak, Taejin Lee,Hyun-chul Lee,Chuantong Chen,Peihao Geng,Ninshu Ma,Seung-Joon Lee,Dongjin Kim
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T (2024): 3541-3565
Seoah Kim, YehRi Kim, Eunjin Jo, Hyeon-Sung Lee,Sungwook Mhin,Tae-Young Lee,Sehoon Yoo,Yong-Ho Ko,Dongjin Kim
Journal of Materials Research and Technology (2024): 6668-6685
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Seoah Kim, YehRi Kim, Eunjin Jo, Hyeon-Sung Lee,Sungwook Mhin,Tae-Young Lee,Sehoon Yoo,Yong-Ho Ko,Dongjin Kim
Journal of Materials Research and Technology (2024)
Journal of Alloys and Compounds (2024): 174871
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