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个人简介
Giuseppe La Rosa IBM Systems, Hopewell Junction, NY 12533 USA
(larosa@us.ibm.com). Mr. La Rosa is a Senior Technical Staff Member in the Product Technology Interaction
department of the IBM Systems Division. Since he joined IBM in 1989, he has been working in the development of
advanced DRAM and logic technologies with main focus in the front-end-of-the line (FEOL) reliability mechanisms. He is
a worldwide known expert in bias temperature instabilities (BTI) and recently has chaired across-industry working
groups in BTI benchmarking. He has reached his fourth IBM Invention Achievement Plateau and received an IBM
Outstanding Technical Achievement Award for leading the 45-nm FEOL reliability qualification. He has authored or
coauthored 25 technical papers and given several invited talks and tutorials in the area of FEOL reliability physics.
Recently, he has served as General Chair (2015) and Technical Program Chair (2013) of the International Reliability
Physics Symposium. He holds an M.S. degree in electronic materials from MIT and an M.S. in physics from Northeastern
University. He is a Senior Member of the IEEE and a member of the Electron Device Society.
研究兴趣
论文共 6 篇作者统计合作学者相似作者
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Scott R. Stiffler,Ravikumar Ramachandran, W. Kirklen Henson, Noah D. Zamdmer,Kevin McStay,Giuseppe La Rosa,Kevin M. Boyd,Sungjae Lee,Claude Ortolland,Paul C. Parries
IEEE Transactions on Device and Materials Reliabilityno. 1 (2010): 40-46
San Jose, CApp.274-282E, (2006)
mag(2000)
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