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论文共 21 篇作者统计合作学者相似作者

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Investigation of different thermomechanical behaviours in one batch of QFN packages
Ariane Tomas,Hélène Frémont,Nathalie Malbert,Nathalie Labat,Benoit Lambert, Bernard Plano
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-6, (2024)
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RC delay mitigation for sub 700 nm hybrid bonding pitch
Sandrine Lhostis, Bassel Ayoub,Hélène Frémont,Stéphane Moreau,Sebastien Mermoz,Emilie Deloffre,Emeline Souchier, Maria Gabriela Gusmão Cacho, Ece Aybeke, Patrick Lamontagne, Christelle Rey,Arnaud Tournier
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.396-403, (2023)
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Recent Advances on Qualification and Reliability of Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D ICs
S. Moreau,Bassel Ayoub, S. Lhostis, D. Bouchu,Hélène Fremont
HAL (Le Centre pour la Communication Scientifique Directe) (2023)
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Recent Advances on Electromigration in Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D Integrated Circuits
S. Moreau, D. Bouchu, J. Jourdon,B. Ayoub, S. Lhostis,H. Frémont, P. Lamontagne
2023 IEEE International Reliability Physics Symposium (IRPS)pp.1-7, (2023)
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Sub $1\ \mu \mathrm{m}$ Pitch Achievement for Cu/SiO2 Hybrid Bonding
Bassel Ayoub,Sandrine Lhostis,Stephane Moreau,Emeline Souchier,Emilie Deloffre,Sebastien Mermoz, Maria Gabriela Gusmao Cacho, Norah Szekely, Christelle Rey, Ece Aybeke, Victor Gredy,Patrick Lamontagne,
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (2022)
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Moisture Diffusion Inside the BEOL of an FC-PBGA Package
Quentin Vandier,Hélène Frémont,Dominique Drouin
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 11 (2022): 1740-1747
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2D Model for moisture diffusion in integrated Low-k dielectrics
Léo Mischler, Vivien Cartailler,Genevieve Duchamp,Hélène Fremont, Grégory Imbert, J. B Moulard, Olivier Kermarrec
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-6, (2022)
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