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排名必读论文期刊顶会热点AI 简史溯源树小脉星探人才迁徙塔尖人才国防情报追踪开源工具智慧手语
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论文共 292 篇作者统计合作学者相似作者

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Q-factor improvement of surface ion trap fabrication
Hongyu Li, Morteza Ahmadi, Huihong Liu, Norhanani Jaafar, Mishra Dileep, Chun Kiat Goh, YanYan Zhou,Manas Mukherjee
Quantum Computing, Communication, and Simulation IV (2024)
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Improved waveguide surface roughness by foundry-processing techniques for enhanced light delivery to integrated ion trap for quantum computing platforms
Simon Chun Kiat Goh, Adrian Utama, Haitao Yu,Yan Yan Zhou, Mishra Dileep, Clarence Liu, Morteza Ahmadi,Victor Leong,Manas Mukherjee,Chui King-Jien,Hongyu Li
Optical Interconnects XXIV (2024)
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Alignment through thick Si layer for high resolution patterning on bonded wafers with tight overlay margin using immersion lithography
Arvind Sundaram, Chin Khang Tew, Guo Wei Tan,Yuan-Hsing Fu,Hongyu Li,Nandini Venkataraman, Bhesetti Chandra Rao,Navab Singh
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1150-1155, (2023)
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High-resolution genetic mapping and identification of candidate genes for the wheat stem rust resistance gene Sr8155B1
Jian Wang,Hongyu Li,Tao Shen, Shikai Lyu, Shams ur Rehman,Hongna Li,Guiping Wang, Binyang Xu, Qing Wang, Wanyi Hu, Kairong Li,Shengsheng Bai,
CROP JOURNALno. 6 (2023): 1852-1861
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Demonstration of a CMOS-Compatible Superconducting Cryogenic Interposer for Advanced Quantum Processors
King-Jien Chui,Hongyu Li, Yong Chyn Ng,Chit Siong Lau, K. E. J. Goh,D. Huang, Ya-Ching Tseng, J. K. Chen,H. Yu, B. N. Jaafar, H. Lin, B. Varghese
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.617-622, (2023)
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Optimization of the CMP process for direct wafer-to-wafer oxide bonding
Hong-Miao Ji,Hemanth Kumar Cheemalamarri, Ting-Ta Chi, Hui-ting Lim Serene, Wei-Jie Teo Dickson, Siang-Kiat Neo Alfred,Hong-Yu Li, Gim-Guan Chen Jon, Nandini Venkataraman,Wen Lee
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.421-424, (2023)
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Room Temperature Plasma-Enhanced Niobium-Niobium Wafer Bonding for 3D Integration of Superconducting Interconnects for Quantum Processing
Simon Chun Kiat Goh, Cheemalamarri Hemanth Kumar,Liangxing Hu, Woon Shervonne,Norhanani Jaafar, Yap Lee Khoon Sherry,Ding Huang,Chit Siong Lau, Senthil Kumar Karuppannan,Hongyu Li,Chuan Seng Tan,King-Jien Chui
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.404-408, (2023)
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CMOS-Compatible Fine Pitch Al-Al Bonding
Hemanth Kumar Cheemalamarri, Binni Varghese,Sharma Jaibir,Li Hongyu, Chandra S. S. Rao,Navab Singh,Vempati Srinivasa Rao,King-Jien Chui
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1725-1729, (2023)
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