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个人简介
Hai-Feng Wu received the B.E. and M.E. degrees in electronics from the University of Electronic Science and Technology of China, Chengdu, China, in 2007 and 2010, respectively, and the Ph.D. degree in microelectronics and solid-state electronics from Tianjin University, Tianjin, China, in 2016.
From 2010 to 2011, he was an Engineer with Accelicon Technologies, Inc., Beijing, China, where he was involved in the transistor model building. Since 2016, he has been an Engineer with the Chengdu Ganide Technology, Chengdu, where he is involved in RFIC design. His current research interests include RF transistors modeling and the power amplifier design in monolithic microwave-integrated circuit.
研究兴趣
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INTERNATIONAL JOURNAL OF NUMERICAL MODELLING-ELECTRONIC NETWORKS DEVICES AND FIELDSno. 2 (2024)
INTERNATIONAL JOURNAL OF RF AND MICROWAVE COMPUTER-AIDED ENGINEERING (2024): 1-11
2023 IEEE MTT-S INTERNATIONAL CONFERENCE ON NUMERICAL ELECTROMAGNETIC AND MULTIPHYSICS MODELING AND OPTIMIZATION, NEMOpp.124-126, (2023)
2023 International Conference on Microwave and Millimeter Wave Technology (ICMMT)pp.1-3, (2023)
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2023 International Conference on Microwave and Millimeter Wave Technology (ICMMT)pp.1-3, (2023)
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2023 IEEE MTT-S International Wireless Symposium (IWS)pp.1-4, (2023)
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CIRCUIT WORLDno. 2 (2023): 167-173
2023 IEEE MTT-S INTERNATIONAL CONFERENCE ON NUMERICAL ELECTROMAGNETIC AND MULTIPHYSICS MODELING AND OPTIMIZATION, NEMOpp.130-132, (2023)
INTERNATIONAL JOURNAL OF RF AND MICROWAVE COMPUTER-AIDED ENGINEERINGno. 12 (2022)
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