基本信息
浏览量:0
职业迁徙
个人简介
Hyungjun Kim (Member, IEEE) received the B.S. and M.S. degrees from the Department of Inorganic Materials, Seoul National University, Seoul, South Korea, in 1990 and 1992, respectively, and the Ph.D. degree in materials science and engineering from the University of Illinois at Urbana-Champaign, Champaign, IL, USA, in 1998.
He is a Professor with the School of Electrical and Electronic Engineering, Yonsei University, Seoul. He is also the Director of the Air Liquide-Yonsei Joint Research Center (ALYC), Yonsei University. Before he joined the Faculty of Yonsei University in 2009, he was a Faculty with the Department of Materials Science and Engineering, Pohang University of Science and Technology (Postech), Pohang, South Korea, from 2004 to 2009; and a Research Staff Member with the Department of Silicon Technology, IBM Research Division, Yorktown Heights, NY, USA, from 2000 to 2004. He pioneered plasma-enhanced ALD (PE-ALD) of metals and nitrides for Cu interconnect technologies and explored various thin-film processes for CMOS and novel nanodevices fabrication. Prior to joining IBM Research in 2000, he was a Visiting Research Professor with the University of Illinois at Urbana-Champaign, where he carried out research in the surface chemistry and growth of thin layers of silicon–germanium alloys and metal and nitride thin films. He also served as the Director for the Applied-Materials Yonsei Emerging Research Center (AYET) from 2009 to 2014. He is the author of more than 200 technical publications in international journals and filed or awarded more than 50 patents. His main research interests include advanced thin-film technology focusing on atomic layer deposition (ALD) and nanoscale device fabrication.
Dr. Kim is a member of the American Vacuum Society. He is also a member of the Organizing Committee for several international conferences, including the American Vacuum Society, the Materials Research Society, and the Topical Conference on Atomic Layer Deposition. He is also an Editorial Board Member of Thin Solid Films and Metals and Materials International. He has also given invited lectures/presentations at numerous technical conferences and is active in conference organizing. He served as the Organizing Chair for the 2006 ALD Topical Conference on ALD, Seoul.
研究兴趣
论文共 11 篇作者统计合作学者相似作者
按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
Meeting abstracts/Meeting abstracts (Electrochemical Society CD-ROM)no. 29 (2023): 1435-1435
semanticscholar(2015)
引用0浏览0引用
0
0
加载更多
作者统计
#Papers: 9
#Citation: 166
H-Index: 5
G-Index: 9
Sociability: 4
Diversity: 0
Activity: 0
合作学者
合作机构
D-Core
- 合作者
- 学生
- 导师
数据免责声明
页面数据均来自互联网公开来源、合作出版商和通过AI技术自动分析结果,我们不对页面数据的有效性、准确性、正确性、可靠性、完整性和及时性做出任何承诺和保证。若有疑问,可以通过电子邮件方式联系我们:report@aminer.cn