基本信息
浏览量:0
职业迁徙
个人简介
Jingchuan Wei received the B.S. degree from Binzhou University, Binzhou, China, in 2010, and the M.S. degree from the Beijing Institute of Technology, Beijing, China, in 2015.
He is currently a Senior Engineer with Tsinghua University, Beijing. His research area is the implementation of artificial intelligence (AI) accelerator and system-on-chip (SoC) design.
研究兴趣
论文共 10 篇作者统计合作学者相似作者
按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
Ruiqi Guo, Xiaofeng Chen, Lei Wang,Yang Wang, Hao Sun,Jingchuan Wei, Huiming Han, Leibo Liu,Shaojun Wei, Yang Hu,Shouyi Yin
IEEE Journal of Solid-State Circuitsno. 99 (2024): 1-13
Yubin Qin,Yang Wang,Dazheng Deng,Xiaolong Yang,Zhiren Zhao, Yang Zhou, Yuanqi Fan,Jingchuan Wei,Tianbao Chen,Leibo Liu,Shaojun Wei,Yang Hu,
IEEE Journal of Solid-State Circuitsno. 99 (2024): 1-15
Ruiqi Guo,Yang Wang, Xiaofeng Chen,Lei Wang,Hao Sun,Jingchuan Wei,Leibo Liu,Shaojun Wei,Yang Hu,Shouyi Yin
2023 IEEE Asian Solid-State Circuits Conference (A-SSCC)pp.1-3, (2023)
2023 IEEE 5th International Conference on Artificial Intelligence Circuits and Systems (AICAS)pp.1-5, (2023)
2023 IEEE Asian Solid-State Circuits Conference (A-SSCC)pp.1-3, (2023)
2023 60th ACM/IEEE Design Automation Conference (DAC)pp.1-6, (2023)
作者统计
合作学者
合作机构
D-Core
- 合作者
- 学生
- 导师
数据免责声明
页面数据均来自互联网公开来源、合作出版商和通过AI技术自动分析结果,我们不对页面数据的有效性、准确性、正确性、可靠性、完整性和及时性做出任何承诺和保证。若有疑问,可以通过电子邮件方式联系我们:report@aminer.cn